Digital Circuit Testing TRIZ Cases

Internal clock generation allows the test logic to access every pad cell path, resolving limitations where shared test pads restrict internal testing.

Software-generated test patterns on high-performance processors overcome FPGA bottlenecks in high-bandwidth device testing.

A method tests multiple edge through-silicon vias at varying distances from chip stack side edges to identify the minimum acceptable placement.

A shunt structure bypasses defective controllers to enable direct external testing, resolving MCP repairability constraints.

An integrated impedance measurement device embeds FFT processing and control logic within the system on chip to characterize internal electrical parameters.

An actuator system adjusts pressure and cross-sectional area on the contactor board assembly to resolve connection complexity during full-wafer testing.

A configurable embedded tester uses firmware-driven protocol and pattern generators to verify component circuitry across diverse communication standards.

Latching circuits stabilize CPLD output signals by holding voltage levels, preventing jitter errors during firmware updates.

Segmented grounded housing minimizes crosstalk and resolves impedance mismatches limiting signals above 2.5 Gbps.

Integrated testing and repairing apparatus detects TSV defects in stacked chips, preventing signal transmission failures.

An integrated optical coupler merges photorelays on a single substrate to reduce installation area.

Comparing absolute signal values between bus lines reduces false positives caused by ground shifts and common mode currents.

A method determines crosstalk parameters in on-wafer calibration models using admittance calculations from S parameter measurements.

An on-chip comparator and storage device measure test voltage levels against a reference signal for efficient high-speed detection.

A data inversion detection circuit uses a transistor array and bias generator to identify bit states.

Blocking reset signals and interrupts allows concurrent master and slave testing, reducing total test time for complex SoCs.

A synchronization unit provides no-result indications during preset pattern cycles to emulate legacy instrument timing.

Segmenting multi-die chip modules into shift and capture modes enables at-speed interconnect testing while eliminating manual boundary scan errors.

Segmented test circuits connect micro-bump contacts into daisy chains, locating open and short defects without excessive testing time.

Separates DUT memory interface protocol from target storage array to maintain cycle accuracy during FPGA simulation.

A circuit system uses a comparator to detect intermediate signal differences between identical circuits during synchronous testing operations.

Segmenting calibration and verification functions resolves the contradiction between high precision and system complexity.

Control circuitry selects between testing and bypass paths within integrated circuit dies to route test signals sequentially through coupled packages.

Distributes command generation to FPGA modules, reducing processor load and enabling simultaneous multi-protocol testing without hardware changes.

An eye opening measurement circuit tracks sigma levels to calculate signal quality differences within a receiver.

A voltage application device sets transient step parameters to form a step-like waveform that reaches the target value quickly.

On-chip DSP generates sinusoidal stimuli to measure DAC and ADC nonlinearity via analog loopback paths.

Integrated encoding and decoding circuits generate test sequences and analyze scan output data, eliminating expensive automatic testing machines.

A test socket assembly integrates a waveguide to capture electromagnetic radiation from radio frequency integrated circuits.

Ring oscillators integrate host wafer and RF chiplet transistors to enable on-chip testing, eliminating pre-assembly verification costs.

A debug control circuit bridges an external debugger to target components, bypassing the powered-down interface block.

Synchronizes capture clocks across multiple clock domains using specific active edge timing relationships to ensure comprehensive transition scan coverage.

Segmented testing hardware isolates probe analysis from assembly lines, enabling precise defect detection and faster production activation.

Internal observers count hardware events to enable detailed runtime monitoring within a System on Chip.