Waveguide Test Socket for EHF IC Over-the-Air Testing
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Solution Overview
Problem
Current systems for testing extremely high frequency (EHF) integrated circuits, particularly over-the-air testing, face limitations due to the bulkiness and inefficiency of horn antenna-based test fixtures, which restrict close proximity testing and result in limited test coverage and increased interference, making it difficult to simultaneously test multiple devices effectively.
Innovation Solution
A test socket assembly that integrates a waveguide to capture EHF radiation from DUTs, using reflective and absorptive materials to enhance coupling and reduce interference, allowing for close proximity testing of multiple DUTs with minimized cross-talk and bulkiness, enabling more efficient parametric testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If horn antennas are used to capture electromagnetic signals from DUTs, then electromagnetic radiation can be captured, but the test fixtures become bulky and DUTs must be widely separated
Solution Approach 1:
The patent extracts the electromagnetic signal capture function from the bulky horn antenna structure and implements it through a compact waveguide integrated directly into the test socket. This allows the same signal capture capability to be achieved with minimal fixture volume, eliminating the need for large radiation chambers and widely spaced DUT placements.
Solution Approach 2:
The waveguide is nested within the test socket structure itself, with the waveguide aperture positioned to receive signals directly from DUTs placed in the socket. This nested integration eliminates the need for separate horn antenna assemblies and radiation chambers, creating a compact multi-site test fixture.
2Measurement precision
If horn antennas are used with radiation chambers to optimize electromagnetic radiation capture, then signal capture is improved, but test fixture bulk increases
Solution Approach 1:
The patent removes the radiation chamber component entirely and achieves optimized electromagnetic radiation capture through the waveguide's direct coupling to the DUT. The waveguide aperture is positioned to receive signals in the DUT's near field, eliminating the need for large radiation chambers while maintaining or improving signal capture efficiency.
3Productivity
If horn antennas are used to test multiple DUTs simultaneously, then parallel testing is enabled, but cross talk increases and DUTs must be widely separated
Solution Approach 1:
The patent segments the electromagnetic signal paths by providing each DUT with its own dedicated waveguide aperture and waveguide structure. This segmentation isolates the signal paths of multiple DUTs, preventing cross talk while enabling simultaneous testing. Each waveguide acts as an independent channel that captures signals from its associated DUT without interference from neighboring DUTs.
4Power
If horn antennas are used for testing, then RF signal transmission is achieved, but the antennas are inefficient transmitters and amplify interference
Solution Approach 1:
The patent extracts the signal reception function from the inefficient horn antenna and implements it through the waveguide, which provides direct coupling to the DUT without the interference amplification problems of horn antennas. The waveguide structure naturally rejects interference signals while efficiently transmitting the DUT's RF signals to the test equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and simultaneous testing of multiple EHF integrated circuits in a compact setup, improving test coverage beyond pass/fail testing and reducing interference, thus facilitating faster developmental and product testing with enhanced data rate capabilities.
Implementation Method 1
The test socket assembly is structured to couple electromagnetic radiation from the DUT into a waveguide
Implementation Method 2
More reflective socket wall materials may be chosen to increase the reflection of DUT signals into the waveguide
Implementation Method 3
More absorptive socket wall materials may be chosen to reduce unwanted scattered signals
Data Source
AI summary
A test system includes a test socket assembly for capturing low energy electromagnetic emissions from radio frequency (RF) integrated circuits (ICs). The test socket assembly is structured to direct electromagnetic radiation from the device under test (DUT) to a socket port coupled to one end of a waveguide for transmission to a tester. The combination of the materials comprising the socket assembly is selected to more efficiently couple electromagnetic emissions from the DUT into the waveguide. For example, a reflective plane with an adjustable position may be located below the DUT in order to increase coupling of electromagnetic radiation from the DUT into the waveguide.