Interposer-Substrate Guide Pattern for Thin Package Alignment
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Solution Overview
Problem
The challenge in semiconductor packaging is aligning interposers and substrates accurately during assembly, particularly with the integration of multiple semiconductor chips, which affects the electrical connectivity and overall package thickness, while maintaining reduced size and increased functionality.
Innovation Solution
Incorporating a guide pattern with guide portions on both sides of a capacitor that is inserted between the interposer and substrate, ensuring precise alignment and electrical connection between the interposer and substrate, and supporting the semiconductor chips with support portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are packaged within a single semiconductor package to expand functionality and reduce size, then data storage capacity, data processing capacity, and functionality are improved, but alignment precision between interposer and substrate deteriorates
Solution Approach 1:
A guide pattern structure is introduced as an intermediary alignment mechanism between the interposer and substrate. The guide pattern includes guide portions that extend into mold compound, creating physical reference features that enable precise alignment during assembly. This intermediary structure resolves the alignment precision issues that arise when packaging multiple chips together.
Solution Approach 2:
The guide pattern is formed in advance during the packaging process, with guide portions extending into the mold compound before final assembly. By pre-establishing these alignment reference features in the mold compound, the system ensures that subsequent alignment operations can achieve high precision without requiring complex real-time adjustment mechanisms.
2Length of stationary object
If the overall thickness of semiconductor packages is decreased to achieve slimmer profile electronic devices, then device profile is improved, but assembly tolerance for alignment deteriorates
Solution Approach 1:
The guide pattern acts as an intermediary alignment mechanism that compensates for reduced assembly tolerance. By providing physical guide portions that extend into the mold compound, the system creates self-aligning features that ensure precise positioning even when working within tighter thickness constraints that reduce available tolerance margins.
Solution Approach 2:
The alignment solution extends into the vertical dimension by having guide portions extend into the mold compound. This three-dimensional approach to alignment provides reference features that accommodate reduced thickness while maintaining horizontal alignment precision, effectively using the depth dimension to solve a horizontal positioning problem.
3Manufacturing precision
If guide pattern with guide portions extending into mold compound is used to improve alignment, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The guide pattern is merged with the mold compound structure, combining the alignment reference function with the existing packaging material. By integrating the guide portions into the mold compound rather than adding separate alignment components, the system achieves improved alignment precision while minimizing increases in overall device complexity.
Solution Approach 2:
The mold compound serves multiple functions: it provides mechanical support, electrical insulation, and now also contains guide portions that provide alignment references. By making the mold compound multi-functional, the system achieves precise alignment without adding dedicated alignment structures that would increase device complexity.
Data Source
AI summary
A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.