Interposer Hole Nesting for Low Stress Compact Device Packages
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Solution Overview
Problem
Existing integrated device packages face challenges in reducing size and minimizing stresses without increasing height, as stacking dies can enlarge the footprint and induce undesirable stresses due to differential expansion of molding materials.
Innovation Solution
The integration of an interposer between two device dies, where one die extends into a hole or recess of the interposer, reduces package height and shields the die from external stresses, while maintaining a low footprint and eliminating the need for molding materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple integrated device dies are stacked on top of one another, then the package footprint on the external device substrate is reduced, but the package height increases
Solution Approach 1:
A portion of the second integrated device die is inserted into a hole formed through the first integrated device die, creating a nested configuration where one component is partially contained within another. This nesting approach reduces the overall package footprint while managing the height increase through strategic placement of die portions within available spaces.
Solution Approach 2:
The invention transitions from a traditional planar side-by-side arrangement to a three-dimensional stacked configuration with vertical integration. By utilizing the vertical dimension and creating through-holes through the first die to accommodate portions of the second die, the package achieves reduced footprint while the height increase is managed through the specific geometry of the through-holes and die placement.
2Reliability
If molding material is used to encapsulate the integrated device package, then the dies are protected from environmental contamination or impact, but undesirable stresses and strains are induced on the dies due to differential expansion
Solution Approach 1:
The invention removes the molding material encapsulation step entirely from the package structure. By eliminating this harmful element, the package achieves stress-free construction while maintaining reliability through alternative protective measures such as the through-hole geometry and direct die-to-substrate connections that do not induce differential expansion stresses.
Solution Approach 2:
The invention converts the potential harm of encapsulation by eliminating it altogether. Instead of using molding material that causes stress, the design relies on the structural integrity of the stacked die configuration with through-holes, which provides protection without the harmful differential expansion effects.
3Device complexity
If multiple integrated device dies are placed side by side on a package substrate, then the package structure is simple, but the package footprint is enlarged
Solution Approach 1:
The invention transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. By placing dies vertically one on top of another with through-holes providing mechanical and electrical connection, the package footprint is significantly reduced while the structural complexity remains manageable through straightforward vertical integration.
Solution Approach 2:
A portion of the second die is nested within the volume occupied by the first die through the through-hole configuration. This nesting approach maximizes space utilization and reduces the overall package footprint while maintaining a relatively simple structure that does not require complex interconnection schemes.
Data Source
AI summary
Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.