Interposer Chip Package Structure for 3D-IC Heat Dissipation

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Solution Overview

Problem

Existing semiconductor packaging technologies face challenges in achieving high density and functionality while managing manufacturing complexities and heat dissipation in 3D-IC devices.

Innovation Solution

A package structure is formed with a redistribution structure, interposer chip, and thermal conductive layers, incorporating active devices for improved electrical communication and heat dissipation, and a protective layer for structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If new packaging technologies are adopted to improve density and functionality, then device performance is enhanced, but manufacturing complexity increases

Engineering Contradiction:

Improvedevice densityVSAvoidmanufacturing complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The packaging technology divides the semiconductor device into separate functional components (die, interposer, encapsulant) that can be manufactured independently and then assembled. This segmentation allows each component to be optimized separately, improving overall device density while managing manufacturing complexity through modular assembly processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs three-dimensional packaging architectures, stacking multiple dies and interposers vertically to increase device density. By transitioning from two-dimensional to three-dimensional arrangements, the technology achieves higher functionality within the same footprint, while the standardized interposer interfaces maintain manufacturing manageability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Speed

If active devices are incorporated to improve electrical communication, then operational speed increases, but heat generation increases

Engineering Contradiction:

Improveoperational speedVSAvoidheat generation

Core Design Contradiction:

SpeedVSTemperature

Solution Approach 1:

The interposer acts as an intermediary component between active devices, providing thermal management functionality. It incorporates thermal vias and conductive pathways that conduct heat away from the active devices, enabling high-speed operation while controlling temperature rise through the intermediary thermal management structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes composite material structures combining different thermal conductivity materials in the interposer and encapsulant layers. These composite structures create optimized thermal pathways that conduct heat efficiently from active devices to heat sinks, allowing high operational speed while managing heat generation through material composition rather than reducing device performance.

Inventive Principle:

Principle #40Composite materials

3Temperature

If thermal conductive layers are added to reduce heat generation, then temperature control improves, but device complexity increases

Engineering Contradiction:

Improvetemperature controlVSAvoidstructural complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The interposer serves multiple functions simultaneously: it provides electrical interconnection between dies, mechanical support for the stacked structure, and thermal management through integrated thermal vias and conductive pathways. This multi-functionality allows temperature control to be achieved without adding separate dedicated thermal management components, thereby limiting the increase in structural complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges thermal management functionality into the existing interposer structure rather than adding separate thermal management layers. The interposer combines electrical interconnection and thermal conduction functions in a single integrated component, achieving temperature control while minimizing the increase in device structural complexity through functional consolidation.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances operational speed, reduces heat generation, and improves performance and reliability of 3D-IC devices by optimizing electrical connections and thermal management.

Implementation Method 1

thermal conductive layers, incorporating active devices for improved electrical communication and heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250357456A1Structure and formation method of package with interposer chip

Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure and a method for forming a package structure are provided. The package structure includes a chip-containing structure bonded to a redistribution structure through multiple first solder bumps. The package structure also includes a memory-containing structure bonded to an interposer chip. The interposer chip is bonded to the redistribution structure through multiple second solder bumps. The package structure further includes a substrate, and the redistribution structure is over the substrate.