Interposer Power and Thermal Control for Programmable Logic Sectors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuits with programmable logic devices face challenges in efficiently managing power consumption across different sectors, as static power is consumed even when sectors are not in use, and power management becomes complex when certain sectors are powered down.
Innovation Solution
The integration of multiple voltage regulators and thermal sensors into an interposer device, which is disposed above or below the integrated circuit, allows for more granular control of power management operations, including power down, voltage frequency scaling, and dynamic voltage frequency scaling, across different sectors or sector groups.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple voltage regulators are integrated into the interposer device for granular power control, then power management precision is improved, but device complexity increases
Solution Approach 1:
The interposer device is divided into multiple tile structures, each containing dedicated voltage regulators and thermal sensors that correspond to specific sectors of the integrated circuit. This segmentation enables granular power control at the sector level while distributing the complexity across modular units rather than concentrating it in a single complex controller.
Solution Approach 2:
The interposer device acts as an intermediary layer between the power supply and the integrated circuit sectors. By placing voltage regulators and thermal sensors on the interposer rather than directly on the IC, the system achieves precise power management while isolating the complexity of multiple regulators from the main IC design.
2Adaptability or versatility
If voltage regulators are placed on the interposer device, then power control flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The interposer is segmented into multiple tiles with each tile containing a complete set of voltage regulators and thermal sensors. This modular segmentation allows for standardized manufacturing of individual tiles that can be replicated and assembled, reducing overall manufacturing complexity while maintaining power control flexibility.
Solution Approach 2:
By moving voltage regulators from the traditional planar layout on the IC to a vertical stacking architecture on the interposer, the design achieves greater power control flexibility without proportionally increasing manufacturing complexity. The regulators are positioned above or below the IC in a third dimension, enabling independent optimization of each layer.
3Measurement precision
If thermal sensors are integrated into each tile on the interposer, then thermal management precision is improved, but device complexity increases
Solution Approach 1:
Thermal sensors are integrated into each tile structure on the interposer, creating a segmented thermal monitoring system that matches the sector division of the IC. This provides precise thermal management at the sector level while distributing sensor complexity across multiple simple, identical tile units rather than requiring a single complex thermal management system.
4Loss of energy
If per-sector power control is implemented, then static power consumption is reduced, but control complexity increases
Solution Approach 1:
The power control system is segmented into multiple independent voltage regulators, each dedicated to controlling power to a specific sector or group of sectors. This segmentation enables individual sectors to be powered down independently, reducing static power consumption while keeping each regulator's control logic simple and modular.
Solution Approach 2:
Each voltage regulator is locally positioned on the interposer to serve its corresponding IC sector, enabling localized power control decisions. This local quality approach allows each sector to have its own dedicated power management resources, reducing overall static power consumption without requiring a single complex centralized controller.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An integrated circuit assembly may include an integrated circuit having a plurality of programmable logic sectors and an interposer circuit positioned adjacent to the integrated circuit. The interposer circuit may include at least one voltage regulator that distributes a voltage to at least one of the plurality of programmable logic sectors and at least one thermal sensor that measures a temperature of the at least one of the plurality of programmable logic sectors.