Interposer Recesses for Passive Element Dimensional Control
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Solution Overview
Problem
Conventional screen-printing techniques for forming passive elements like resistors and capacitors in semiconductor devices face challenges in achieving precise electrical properties due to dimensional variability, leading to imprecise resistance values and larger component sizes, which limits design flexibility and increases costs with laser trimming processes.
Innovation Solution
The use of an interposer with recesses formed in a dielectric layer, filled with conductive material to create passive elements, allowing for precise control of dimensions and electrical properties, reducing variability and enabling more compact designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional screen-printing techniques are used to form passive elements, then the manufacturing process is simple and cost-effective, but the dimensional precision and electrical property accuracy deteriorate due to dimensional variability during processing
Solution Approach 1:
The patent applies preliminary action by forming recesses in the substrate before depositing the conductive paste. This pre-formed structure constrains the paste during subsequent drying and firing processes, preventing dimensional changes and ensuring precise final dimensions. The recesses act as physical boundaries that maintain the intended geometry throughout processing.
Solution Approach 2:
The recess structure serves as an intermediary element between the screen-printing process and the final passive element. It provides a controlled environment within the substrate that mediates the interaction between the deposited paste and the substrate, ensuring dimensional stability while maintaining the simplicity of screen-printing deposition.
2Measurement precision
If screen-printing paste is deposited without recesses, then the manufacturing process is simpler, but the electrical property accuracy deteriorates due to unpredictable dimensional changes during drying and firing
Solution Approach 1:
The recesses are formed in advance before paste deposition, establishing precise geometric boundaries that control the final dimensions of the passive elements. This preliminary structuring ensures that the electrical properties, which depend on precise dimensions, can be accurately controlled without complicating the overall manufacturing flow.
3Manufacturing precision
If larger resistor sizes are used to achieve adequate tolerance, then the electrical property accuracy improves, but the area occupied by each component increases, reducing design flexibility
Solution Approach 1:
The patent changes the geometric parameter of the substrate by introducing recesses, which fundamentally alters how the passive element dimensions are determined. Instead of relying on large areas to achieve adequate tolerance through process robustness, the recesses enable precise dimensional control at smaller scales, allowing high-precision passive elements in compact form factors.
4Measurement precision
If laser trimming is used to adjust resistance values, then the electrical property accuracy improves, but the manufacturing cost and process complexity increase
Solution Approach 1:
The recesses are formed preliminarily to establish precise dimensional boundaries, enabling the passive elements to achieve their target electrical properties directly during the screen-printing process. This eliminates or reduces the need for subsequent laser trimming operations, thereby reducing manufacturing cost and process complexity while maintaining high electrical property accuracy.
Data Source
AI summary
An interposer for assembly with a semiconductor die and methods of manufacture are disclosed. The interposer may include at least one passive element at least partially defined by at least one recess formed in at least one dielectric layer of the interposer. The at least one recess may have dimensions selected for forming the passive element with an intended magnitude of at least one electrical property. At least one recess may be formed by removing at least a portion of at least one dielectric layer of an interposer. The at least one recess may be at least partially filled with a conductive material. For instance, moving, by way of squeegee, or injection of a conductive material at least partially within the at least one recess, is disclosed. Optionally, vibration of the conductive material may be employed. A wafer-scale interposer and a system including at least one interposer are disclosed.