Interposer Recessed Edge Design for IC Package Footprint Reduction
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Solution Overview
Problem
Conventional integrated circuit packaging designs face challenges in reducing size and increasing performance due to large footprints, which hinder the integration of diverse technologies like high-capacity memory and high-speed processors within a single package, especially in space-constrained applications.
Innovation Solution
An integrated circuit packaging system featuring a base package substrate with a first integrated circuit die, an interposer having recessed edges and corners extending to singulation edges, and electrical interconnects that allow for stacking and efficient encapsulation without increasing the package footprint, using an interposer array with access openings for encapsulant flow and stable mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple integrated circuit dies are stacked within a single package to increase circuit density, then the functionality and circuit capacity are improved, but the package footprint on the mounting surface increases
Solution Approach 1:
The patent transitions from two-dimensional lateral arrangement of circuit dies to three-dimensional vertical stacking. Multiple dies are arranged in stacked layers along the vertical dimension, allowing increased circuit density without expanding the horizontal footprint on the mounting surface. The interposer enables this vertical integration by providing through-silicon vias and bonding interfaces that connect dies across multiple layers.
Solution Approach 2:
The patent implements a nested structure where multiple integrated circuit dies are contained within a single package housing. The dies are stacked one inside another vertically, with each die nested within the same package boundary. This nesting approach allows multiple functional units to be integrated within a compact package volume, maintaining a small footprint while increasing overall circuit capacity.
2Stability of the object's composition
If the interposer extends to the singulation edge to provide stable mounting, then the mechanical stability is improved, but the encapsulant flow is blocked and excess encapsulant is generated
Solution Approach 1:
The patent removes the interposer material from the edge regions of the package, creating recessed edges that do not extend to the singulation edge. This extraction of interposer material from problematic edge zones allows encapsulant to flow freely to the package periphery during molding, preventing excess encapsulant generation while maintaining sufficient interposer area for stable mounting in the central region.
Solution Approach 2:
The patent applies different structural characteristics to different regions of the interposer. The central region maintains full interposer extension for stable mounting and electrical interconnect, while the edge regions are recessed to enable proper encapsulant flow. This local differentiation optimizes both mechanical stability and encapsulation quality without compromising either function.
3Stability of the object's composition
If the interposer is mounted with full extension to the singulation edge, then the mounting stability is improved, but the encapsulant cannot flow properly and warping occurs
Solution Approach 1:
The patent extracts interposer material from the edge regions, creating recesses that prevent the interposer from extending to the singulation edge. This removal of edge material eliminates the constraint that blocked encapsulant flow, allowing proper encapsulation while the central interposer portion maintains mounting stability.
Solution Approach 2:
The interposer exhibits local quality variations where the central region provides stable mounting support with full extension, while the edge regions are recessed to enable encapsulant flow. This spatial differentiation resolves the conflict between mounting stability and encapsulation quality by optimizing each region for its primary function.
Data Source
AI summary
An integrated circuit packaging system comprising: a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge.