Semiconductor Interposer Release Film for Residue-Free Detachment
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Solution Overview
Problem
The existing methods for manufacturing semiconductor packages face challenges in reducing fabrication failures due to adhesive residues left behind during the process of mounting multiple semiconductor chips in a single package, which affects reliability and increases process time.
Innovation Solution
A method involving a release film with a base layer, intermediate layer, and adhesive layer is used, where the release film includes a light absorber and a gas foaming agent. The film is attached to the semiconductor package, and specific wavelengths of light are applied to create an air gap between the film and the package, allowing for clean detachment and reducing residue formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If multiple adhesive pieces are used to fasten substrates during semiconductor chip mounting processes, then the substrates can be securely held during cutting and mounting operations, but adhesive residues are left behind when the adhesive pieces are removed, causing fabrication failures
Solution Approach 1:
The adhesive piece is divided into three distinct layers: a base layer for fastening, an intermediate layer for controlled detachment, and a release layer for clean separation. This segmentation allows each layer to perform its specific function without causing residue contamination, resolving the contradiction between strong fastening and clean removal
Solution Approach 2:
The intermediate layer acts as a mediator between the base layer and release layer, enabling controlled detachment. This intermediate layer facilitates the transition from strong adhesion to clean release, preventing direct contact between the substrate and the release layer that would cause residue contamination
2Reliability
If a release film is used to enable clean detachment of semiconductor chips from substrates, then adhesive residue contamination is reduced, but additional process steps and time are required for attaching and detaching the release film
Solution Approach 1:
The release film is attached to the substrate before any chip mounting or cutting operations are performed. This preliminary action ensures that the release mechanism is already in place, allowing for clean detachment later without requiring additional time-consuming steps during the main fabrication process
Solution Approach 2:
The release film structure serves multiple functions: fastening the substrate during processing, protecting against residue contamination, and enabling clean detachment. By combining these functions into a single multi-layer component, the number of separate process steps is reduced
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces fabrication failures and process time by enabling clear separation of the semiconductor package from the release film, improving reliability and efficiency in the semiconductor package manufacturing process.
Implementation Method 1
The intermediate substrate may include a light absorber absorbing a portion of the first light
Implementation Method 2
The adhesive layer of the release film may include a gas foaming agent reacting with the first light
Implementation Method 3
The adhesive layer of the release film may include a gas foaming agent reacting with the first light and a light curing agent reacting with the second light
Data Source
AI summary
Disclosed is a method of fabricating a semiconductor package. The method may include providing a preliminary interposer substrate including connection terminals on a carrier substrate such that the connection terminals are oriented outward, preparing a release film including a base layer, an intermediate layer, and an adhesive layer, attaching the connection terminals to a first surface of the release film, detaching the carrier substrate from the preliminary interposer substrate, cutting the preliminary interposer substrate to form a plurality of interposer substrates separated from each other, irradiating a first light of a first wavelength onto the release film to form an air gap between the connection terminals and the release film, and detaching the interposer substrates from the release film. The intermediate substrate may include a light absorber absorbing the first light.