Interposer Shielding Structure Mitigates Crosstalk

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Solution Overview

Problem

The challenge in semiconductor packaging is to reduce crosstalk between interconnections while maintaining a compact form factor and low manufacturing costs, as high-density interconnects can lead to increased interference between signal lines.

Innovation Solution

The implementation of an interposer structure with electrically conductive shielding structures and through substrate vias, where the shielding structures are connected to the vias at the front side of the interposer substrate die, allowing for effective shielding without additional contact interfaces, thereby reducing crosstalk between signal lines without increasing the size of the interposer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If high-density interconnects are used to reduce form factor, then area is reduced, but crosstalk between signal lines increases

Engineering Contradiction:

Improveinterposer areaVSAvoidcrosstalk

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an electrically conductive shielding structure as an intermediary element between signal lines. This shielding structure acts as a mediator that blocks electromagnetic interference between adjacent interconnections, reducing crosstalk while allowing high-density routing on the interposer substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The shielding structures are selectively placed in specific locations where crosstalk is most problematic, rather than uniformly across the entire interposer. This local application of shielding provides targeted protection against interference while minimizing the overall area occupied by shielding elements.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If shielding structures are added to reduce crosstalk, then crosstalk is reduced, but device complexity increases

Engineering Contradiction:

ImprovecrosstalkVSAvoidinterposer structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines the shielding structure formation with the existing through-substrate via process. The shielding structures are formed within the same via holes that are already being created for electrical connections, merging two functions (shielding and via creation) into a single manufacturing step, thereby reducing overall process complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The through-substrate vias serve multiple functions: they provide electrical connections between layers and simultaneously house the shielding structures. This multi-functionality reduces the need for separate shielding components and simplifies the overall interposer architecture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If additional contact interfaces are added for shielding, then shielding effectiveness is improved, but manufacturing cost increases

Engineering Contradiction:

ImprovecrosstalkVSAvoidmanufacturing cost

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent merges the shielding function with the existing contact interface structures. The shielding structures are integrated into the through-substrate vias that already connect to contact interfaces, eliminating the need for additional dedicated contact interfaces solely for shielding purposes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The existing contact interface structures serve dual purposes: providing electrical connections and supporting shielding functions. The through-substrate vias that are already being manufactured for electrical connectivity are utilized to house the shielding materials, making the existing infrastructure serve the additional shielding function without requiring separate dedicated structures.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively mitigates crosstalk between signal lines by providing a reference potential through the shielding structure, allowing for a higher density of interconnects without increasing the size of the interposer, thus enhancing signal integrity and reducing manufacturing costs.

Implementation Method 1

an electrically conductive shielding structure extending from a front side of an interposer substrate die into the interposer substrate die, wherein the electrically conductive shielding structure ends before reaching a back side of the interposer substrate die

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10056528B1Interposer structures, semiconductor assembly and methods for forming interposer structures

Publication Date: 2018.08.21 INTEL CORP

AI summary

An interposer structure includes a plurality of front side contact interface structures for connecting the interposer structure to at least one other structure. Additionally, the interposer structure includes a plurality of back side contact interface structures for connecting the interposer structure to at least one other structure. Further, the interposer structure includes a first through substrate via and an electrically conductive shielding structure. The electrically conductive shielding structure ends before reaching a back side of the interposer substrate die and the first through substrate via is connected to the electrically conductive shielding structure at a front side of the interposer substrate die.