Interposer-Backed Semiconductor Assembly for Thin Thermal Layouts
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Solution Overview
Problem
Semiconductor device assemblies face challenges in achieving both thinness and thermal efficiency, particularly as they become more powerful and generate more heat, with existing designs often requiring additional thickness and complexity to accommodate varying die sizes and effective heat dissipation.
Innovation Solution
The use of interposers attached to the back side of a substrate, which allows a controller die to be positioned closer to the exterior surface for improved heat conduction and includes a subset of external contacts on the interposer to maintain a uniformly-spaced ball grid array, enabling efficient heat dissipation without increasing assembly size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If semiconductor devices are made thinner, then the assembly size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent positions high-power dies laterally near the assembly surface rather than stacking them vertically, utilizing the planar dimension to improve thermal access without increasing thickness. The interposer carries selected external contacts on its top surface, redistributing I/O in the lateral plane to accommodate thermal management requirements while maintaining thin profile.
Solution Approach 2:
The interposer acts as an intermediary component between the substrate and high-power dies, providing a platform that facilitates thermal management. It carries a subset of external contacts and enables closer positioning of controller dies to heat-dissipating components without direct substrate attachment, mediating between electrical connectivity requirements and thermal management needs.
2Temperature
If controller dies are positioned closer to exterior surface for heat conduction, then thermal efficiency is improved, but device complexity increases
Solution Approach 1:
The interposer serves multiple functions simultaneously: it provides mechanical support for controller dies positioned near the surface, carries a subset of external contacts for I/O connectivity, and facilitates thermal management pathways. This multi-functionality reduces overall assembly complexity despite the non-traditional die positioning.
Solution Approach 2:
The patent segments the external contacts into two groups: those carried on the substrate and those carried on the interposer. This segmentation allows the interposer to handle specific I/O requirements while the substrate handles others, enabling simplified thermal pathways for high-power dies without requiring complete redesign of the entire assembly architecture.
3Temperature
If interposer carries subset of external contacts, then thermal pathways are improved, but manufacturing complexity increases
Solution Approach 1:
The interposer carries only a subset of external contacts rather than all I/O, providing sufficient thermal and electrical functionality without requiring complete interposer implementation. This partial action approach simplifies manufacturing compared to full interposer designs while achieving the necessary thermal management objectives.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation from high-power dies by locating them nearer the assembly's surface and allows for a thinner, more thermally efficient design without adding thickness or complexity, facilitating better integration with larger system-level heat-dissipating components.
Implementation Method 1
locating a controller die between the assembly substrate and the interposer, the controller can be closer to an exterior surface of the assembly, facilitating the conduction of heat away from the controller die
Data Source
AI summary
A semiconductor device assembly comprises a substrate including internal contacts on a first side and first external contacts on a second side. The assembly further comprises one or more first dies disposed over the first side and electrically coupled to the internal contacts, and a interposer having a length and a width less than a length and a width of the substrate, having inner contacts on a first side, and having second external contacts on a second side. The interposer is coupled to the second side of the substrate by one or more of the inner contacts. The assembly further comprises a second die disposed between the substrate and the interposer. The assembly further comprises first solder balls on the first external contacts, and second solder balls on the second external contacts. The first and second solder balls are configured to bond with co-planar package contacts.