Light Source Module with Inverted LED Die and Reflective Base
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Solution Overview
Problem
Conventional light source modules with LEDs suffer from low luminous efficiency due to light being blocked by electrode layers and have thickness issues due to packaging, which hinders miniaturization and uniform light output.
Innovation Solution
A light source module design featuring a substrate with microstructures, a luminous layer, and a supporting base that reflects light without the need for wire bonding, allowing for direct electrical connection and reduced thickness, along with an encapsulation layer for protection and adjustable light patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional LED structure with P-type and N-type electrodes is used, then electrical connection is achieved, but light beam is blocked and luminous efficiency deteriorates
Solution Approach 1:
The patent extracts and removes the light-blocking P-type and N-type electrode layers from the light output path. By eliminating these obstructive layers, the light beam can escape the LED die without being blocked, directly improving luminous efficiency while simplifying the overall structure.
Solution Approach 2:
Instead of having electrodes on top blocking the light, the patent inverts the electrode configuration by placing contact pads on the bottom surface of the LED die. This inversion allows the light to escape upward through the substrate without obstruction from electrodes, resolving the contradiction between electrical connection and light output.
2Length of moving object
If wire bonding process is used for electrical connection, then LED die can be connected to circuit board, but package thickness increases
Solution Approach 1:
The patent extracts and eliminates the wire bonding process and carrier plate from the packaging structure. By directly mounting the LED die with inverted electrodes onto the circuit board, the unnecessary thickness-contributing elements are removed, achieving miniaturization while simplifying manufacturing.
Solution Approach 2:
The patent inverts the conventional packaging approach by flipping the LED die so that contact pads face downward toward the circuit board. This inversion eliminates the need for wire bonding and carrier plates, directly reducing package thickness and enabling direct mounting.
3Illumination intensity
If light beam escapes upward through LED die, then light output is achieved, but light is blocked by covering layers and electrodes
Solution Approach 1:
The patent extracts and removes the light-blocking P-type covering layer, N-type covering layer, and electrode structures from the light output path. This extraction allows the light beam to escape through the substrate without being blocked by multiple layers, improving light output while simplifying the structure.
Solution Approach 2:
The patent inverts the LED die structure so that the light-generating multiple quantum well layer is positioned with its light output direction toward the substrate. This inversion, combined with removing top layers, allows light to escape through the substrate without being blocked by covering layers and electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances luminous efficiency by 1.6 to 3 times and reduces module thickness, improving light output and miniaturization while minimizing color differences between LED elements.
Implementation Method 1
After a portion of the light beam is projected to and reflected by the supporting base, the portion of the light beam is projected to surroundings through the LED die
Implementation Method 2
When a current is applied to a semiconductor material of Group III-V such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide (GaAs) or indium phosphide (InP), electrons recombine with holes. Consequently, the extra energy is released from a multiple quantum well (MQW) in the form of photons, and the light beam visible to the eyes is generated.
Data Source
AI summary
A light source module includes a LED die, a supporting base and an encapsulation layer. The LED die emits a light beam. The supporting base is electrically connected with the LED die, and supports the LED die. After a portion of the light beam is projected to and reflected by the supporting base, the portion of the light beam is projected to surroundings through the LED die. The encapsulation layer covers the LED die and a portion of the supporting base to protect the LED die. The encapsulation layer includes a light-adjusting element. A light pattern of the light beam is adjustable according to a shape of the encapsulation layer.