Inverter Capacitor Module Cooling With Integrated Refrigerant Flow
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Solution Overview
Problem
Conventional inverter devices for electric vehicles lack efficient cooling methods for capacitor modules, which hampers their performance and requires further improvement in cooling efficiency.
Innovation Solution
The inverter device incorporates a housing with a flow path for refrigerant that directly cools both the power module and capacitor module, utilizing a metal heat transfer portion to enhance heat dissipation, allowing the refrigerant to flow between the inner wall surface of the opening portion and the heat transfer portion, thereby efficiently cooling the capacitor module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat transfer plate is used to cool the capacitor module, then the capacitor module can be cooled, but the cooling efficiency is insufficient compared to direct refrigerant cooling
Solution Approach 1:
The invention extracts the heat transfer function from a separate heat transfer plate and integrates it directly into the capacitor case. The capacitor case itself is formed with a refrigerant flow path, eliminating the need for an additional heat transfer plate component. This allows direct refrigerant cooling of the capacitor module while reducing structural complexity.
Solution Approach 2:
The invention merges the capacitor case structure with the refrigerant cooling system. The capacitor case is integrated with a flow path that allows refrigerant to circulate directly, combining the housing function with the heat dissipation function into a single unified structure, thereby improving cooling efficiency without adding complexity.
2Temperature
If the capacitor module is housed separately from the housing, then the structure is simpler, but the cooling efficiency and space utilization are reduced
Solution Approach 1:
The invention implements a nested structure where the capacitor module is housed within a recessed portion of the housing. The capacitor case is positioned inside the housing with its heat transfer portion exposed to the refrigerant flow path, creating a nested arrangement that maximizes space utilization and enables efficient heat dissipation through direct refrigerant contact.
3Productivity
If conventional cooling methods are used for the power semiconductor module and capacitor module, then both can be cooled, but the overall cooling efficiency and compactness are compromised
Solution Approach 1:
The invention creates a universal refrigerant cooling system that serves multiple functions: it cools both the power semiconductor module and the capacitor module through a unified refrigerant circulation path. The housing structure integrates flow paths for both cooling needs, enabling a single refrigerant system to handle multiple heat dissipation requirements, thereby improving overall cooling efficiency and compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances the cooling efficiency of the capacitor module, enabling quicker and more effective heat management, which is crucial for the high-current applications in electric vehicles, while also allowing for a more compact design by embedding the capacitor module within the housing.
Implementation Method 1
The capacitor case includes a heat transfer portion that is made of metal and configured to cover the first opening portion. The refrigerant flows between an inner wall surface of the first opening portion and the heat transfer portion.
Implementation Method 2
The housing includes a wall portion that is provided with a flow path through which a refrigerant flows... The refrigerant flows between an inner wall surface of the first opening portion and the heat transfer portion.
Data Source
AI summary
One aspect of an inverter device of the present disclosure includes a capacitor module having a capacitor element and a capacitor case that houses the capacitor element, and a housing having a housing space for housing the capacitor module. The housing includes a wall portion that is provided with a flow path through which a refrigerant flows and a first opening portion that allows a part of the flow path to open toward the housing space. The capacitor case includes a heat transfer portion that is made of metal and configured to cover the first opening portion. The refrigerant flows between an inner wall surface of the first opening portion and the heat transfer portion.