Photovoltaic Inverter Cooling Layout for High-Density Power Transistors
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Solution Overview
Problem
Conventional heat dissipation methods for photovoltaic inverters are inadequate in managing increasing heat generated by high-power and dense power transistors, leading to reduced service life and reliability due to ineffective cooling.
Innovation Solution
A top-mounted heat dissipation photovoltaic inverter device with a modular design incorporating a top-installed heat dissipation assembly featuring a condenser and fan assembly, and a back-mounted heat dissipation assembly with an evaporator and air-cooled heat sink, arranged in a compact L-shaped configuration to enhance heat dissipation efficiency and maintainability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation methods (die-casting integrated heat sink or shovel-tooth heat sink with forced air cooling) are used, then the inverter structure is simple, but the heat dissipation capability is insufficient for high-power and high-density power transistors
Solution Approach 1:
The heat dissipation system is divided into two independent modules: a top-mounted heat dissipation module with condenser and fan assembly, and a back-mounted heat dissipation module with evaporator and air-cooled heat sink. Each module handles specific heat dissipation tasks, allowing the system to achieve high heat dissipation capability while maintaining modular simplicity and ease of maintenance.
2Power
If power and density of power transistors are increased, then the inverter power output is improved, but the heat generated increases and affects service life and reliability
Solution Approach 1:
A refrigerant circulation system acts as an intermediary between the power transistors and the external environment. The refrigerant absorbs heat from the power transistors through the evaporator, transports it to the condenser for dissipation, and returns to the evaporator, effectively managing the temperature of high-power transistors without direct thermal contact with ambient air.
3Volume of moving object
If the inverter uses a compact design, then the device size is reduced, but the heat dissipation assemblies may block each other and reduce heat dissipation effect
Solution Approach 1:
The heat dissipation assemblies are arranged in different spatial dimensions and orientations: the top-mounted module is positioned vertically on the top surface with vertical air flow, while the back-mounted module is positioned on the back surface with horizontal air flow. This multi-dimensional arrangement allows compact integration without mutual blocking, maintaining effective heat dissipation in a reduced device footprint.
4Device complexity
If the heat dissipation assemblies are integrated into a single unit, then the structure is simplified, but the maintenance of individual components becomes difficult
Solution Approach 1:
The heat dissipation system is segmented into two independently installable and maintainable modules: the top-mounted heat dissipation module and the back-mounted heat dissipation module. Each module can be accessed, removed, and maintained separately, allowing technicians to service specific components without disassembling the entire heat dissipation system, thus improving ease of repair while maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design effectively dissipates heat, improving the reliability and service life of the inverter by reducing temperature within the device, increasing assembly efficiency, and facilitating convenient maintenance while maintaining a compact structure.
Implementation Method 1
The evaporator and the condenser dissipate heat for the inverter circuit
Implementation Method 2
The evaporator and the condenser dissipate heat for the inverter circuit
Implementation Method 3
The condenser and the fan assembly are arranged adjacently in a second direction
Implementation Method 4
The evaporator and the condenser dissipate heat for the inverter circuit
Implementation Method 5
The condenser and the fan assembly are arranged adjacently in a second direction
Implementation Method 6
the air-cooled heat sink dissipates heat for the box
Implementation Method 7
the air-cooled heat sink dissipates heat for the box
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
This application relates to the field of heat dissipation technologies, and discloses a top-mounted heat dissipation photovoltaic inverter device. The inverter device includes an inverter module and a top-mounted heat dissipation module. The inverter module includes an inverter circuit and a box (1), and the inverter circuit is installed in the box (1). The inverter circuit includes a power circuit board and a plurality of power transistors. The top-mounted heat dissipation module includes a top-installed heat dissipation assembly and a back-mounted heat dissipation assembly The top-installed heat dissipation assembly includes a condenser (21) and a fan assembly (22). The back-mounted heat dissipation assembly includes an evaporator (31) and an air-cooled heat sink (32). The condenser (21) and the box (1) are arranged in a laminated manner in a first direction (N). The condenser (21) and the fan assembly (22) are arranged adjacently in a second direction (P). The box (1), the evaporator (31), and the air-cooled heat sink (32) are arranged sequentially and adjacently in the second direction (P). A projection of the top-installed heat dissipation assembly does not overlap with a projection of the back-mounted heat dissipation assembly in a third direction (M). The first direction (N), the second direction (P), and the third direction (M) are perpendicular to each other. The top-mounted heat dissipation module can dissipate heat for the inverter module, thereby improving reliability of the inverter device.