Ion Beam Cross-Section Processing for Precise Slice Width Measurement
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Solution Overview
Problem
Existing cross-section processing and observation methods face challenges in accurately measuring minute slice widths, leading to unreliable data due to the difficulty in confirming whether observed images are of actual slice widths as small as 1 nm, especially when the slice width approaches the ion beam's diameter.
Innovation Solution
A method and apparatus that involve repeatedly forming cross-sections by irradiating a sample with an ion beam and observing with an electron beam, allowing for the measurement of slice width by setting adjacent sliced regions with varying lengths and observing the resulting cross-sectional images to determine the actual etched slice width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the slice width is reduced to extremely small values to expose minute observation targets, then the ability to observe fine structures is improved, but the reliability of measurement data deteriorates because it becomes difficult to confirm the actual slice width
Solution Approach 1:
The patent applies preliminary action by setting a specific relationship between adjacent sliced regions before performing slice processing. The second sliced region's longitudinal length is predetermined to be obtained by subtracting the slice width from the first sliced region's longitudinal length. This pre-planned configuration enables subsequent measurement of the actual slice width by comparing the etched regions, thereby resolving the reliability issue while maintaining extreme precision in slice width control.
2Manufacturing precision
If the slice width is reduced to extremely small values to observe minute targets, then the observation capability is improved, but the difficulty of detecting and measuring the actual slice width increases
Solution Approach 1:
The patent introduces an intermediary measurement method by using the difference in longitudinal lengths between adjacent sliced regions as a reference for determining actual slice width. By setting the second sliced region's length to be exactly one slice width shorter than the first, the etched pattern creates a measurable intermediate feature that indirectly reveals the slice width. This intermediary approach makes it possible to detect and measure extremely small slice widths that would otherwise be undetectable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate measurement of slice widths, even at minute scales, thereby ensuring highly reliable observation data and improved precision in analyzing semiconductor devices.
Implementation Method 1
slice processing on a sample by irradiation of an ion beam to the sample to form a cross-section
Implementation Method 2
acquisition of a cross-sectional image by irradiation of an electron beam to the cross-section
Data Source
AI summary
A cross-section processing and observation method including: acquiring a surface image by scanning and irradiating a surface of a sample with ion beam; setting, on the surface image, a first sliced region and a second sliced region for performing the slice processing, the second sliced region being adjacent to the first sliced region and having a longitudinal length obtained by subtracting a slice width of the second sliced region from a longitudinal length of the first sliced region; forming a cross-section by irradiating the first sliced region and the second sliced region with the ion beam; and acquiring a cross-sectional image by irradiating the cross-section with electron beam.