In-Situ Electrostatic Chuck Cleaning via Ion Beam
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Solution Overview
Problem
Conventional methods for cleaning electrostatic chucks are time-consuming, costly, and risk damage or contamination due to the need to remove and reinstall the chuck within a process reaction chamber, breaking vacuum and requiring extensive calibration and machine testing.
Innovation Solution
A method involving the use of an ion beam to clean the work surface of the electrostatic chuck within the reaction chamber, adjusting beam parameters based on deposition structure and material to remove contamination through physical or chemical means without moving the chuck, thus maintaining vacuum and avoiding unnecessary machine testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrostatic chuck is removed from the process reaction chamber for cleaning, then the work surface can be cleaned thoroughly, but the cleaning process becomes time-consuming and costly due to reinstallation and calibration requirements
Solution Approach 1:
The invention extracts the cleaning function from the mechanical removal process by introducing an ion beam that can clean the work surface while the electrostatic chuck remains in place. The ion beam delivers reactive ions to chemically react with and remove deposition on the work surface, achieving thorough cleaning without the need to remove and reinstall the chuck.
Solution Approach 2:
The invention replaces the mechanical cleaning system (which requires physical removal, manual cleaning, and reinstallation) with a field-based ion beam system. The ion beam uses electromagnetic fields to generate reactive ions that chemically etch and remove deposition, substituting mechanical operations with a field-based process that occurs in-situ.
2Reliability
If the electrostatic chuck is removed and reinstalled, then cleaning can be performed, but the process requires breaking vacuum and extensive calibration
Solution Approach 1:
The invention extracts the cleaning action from the mechanical removal process by using an ion beam to deliver reactive ions that chemically react with deposition on the work surface. This allows cleaning to occur while the electrostatic chuck remains installed, avoiding vacuum breaking and complex reinstallation procedures.
Solution Approach 2:
The ion beam acts as an intermediary between the cleaning requirement and the installed electrostatic chuck. The reactive ions in the beam serve as a mediator that can access and remove deposition on the work surface without requiring physical access or removal of the chuck, simplifying the overall process.
3Reliability
If conventional cleaning methods are used, then the electrostatic chuck can be cleaned, but there is risk of damage during removal and reinstallation
Solution Approach 1:
The invention extracts the cleaning function from mechanical handling by using an ion beam to remove deposition chemically. This eliminates the mechanical stress and potential damage associated with removing, handling, and reinstalling the electrostatic chuck, preserving its structural integrity.
Solution Approach 2:
The invention replaces mechanical cleaning operations (which involve physical handling and potential damage) with a field-based ion beam process. The ion beam uses electromagnetic fields to generate reactive ions that chemically remove deposition without mechanical contact, eliminating the risk of structural damage during cleaning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces cleaning time and cost, minimizes risk of damage, and maintains high vacuum conditions, allowing for efficient and effective cleaning of the electrostatic chuck without altering existing ion implantation hardware or procedures.
Implementation Method 1
an ion beam is delivered to a work surface of the electrostatic chuck, so as to clean the work surface
Implementation Method 2
the interaction between the ion beam and the depositions on the work surface may remove the depositions away from the electrostatic chuck, no matter whether the interaction is physical bombardment or chemical reaction
Implementation Method 3
the interaction between the ion beam and the depositions on the work surface may remove the depositions away from the electrostatic chuck, no matter whether the interaction is physical bombardment or chemical reaction
Implementation Method 4
the electric fields will be generated on the surface of the dielectric layer when the voltages are applied to these electrodes. Then, pluralities of charges with opposite polarity are generated on the surface of the dielectric layer and the surface of the workpiece respectively, so as to hold the workpiece on the work surface of the electrostatic chuck
Data Source
AI summary
A method of cleaning an electrostatic chuck (ESC) is disclosed. An ion beam is delivered to a work surface of an ESC where no workpiece is held. The interaction between the ion beam and the depositions on the work surface may remove the depositions away the ESC, no matter the interaction is physical bombardment and/or chemical reaction. Hence, the practical chucking force between the ESC and the held workpiece may be less affected by the depositions formed on the work surface during the period of holding no workpiece, no matter the photoresist dropped away the workpiece and/or the particles inside the process chamber. Depends on the details of the depositions, such as the structure, the thickness and the material, the details of ion beam may be correspondingly adjusted, such as the ion beam current, the ion beam energy and the kinds of ions. For example, a low energy ion beam may be used to reduce the potential damages on work surface of the ESC. For example, both the oxygen and the inert gas may be used to generate the ion beam for removing the depositions and protecting the dielectric layer inside the work surface of the ESC.