Ion Trap Substrate Socket Design for Quick Cryogenic Exchange
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Solution Overview
Problem
Existing ion trap devices for quantum computing face challenges in easy and precise mounting, as well as quick exchange, within cryogenic environments, particularly in closed-cycle cryostats where mounting from below is required, complicating thermal contact and optical access.
Innovation Solution
A cryostat socket design featuring a housing frame with a spring pin insert and a housing cover that exerts a compressive force on the substrate, pressing the ion trap device onto contact pins for secure electrical contact and thermal management, while allowing for easy assembly and disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the ion trap device is mounted from below in a closed-cycle cryostat, then thermal contact is improved, but mounting and replacing becomes more difficult
Solution Approach 1:
The patent inverts the conventional mounting approach by mounting the ion trap device from above instead of from below. The sample is inserted into the cryostat through the top opening, and the mounting bracket secures it from the upper side, reversing the traditional bottom-up mounting method while maintaining thermal contact through the mounting bracket's thermal connection to the cryostat cold plate
2Temperature
If the ion trap device is securely mounted for thermal contact, then thermal management is improved, but quick exchange becomes more difficult
Solution Approach 1:
The mounting system is segmented into separable components: a mounting bracket that remains fixed in the cryostat and a sample holder that can be independently inserted and removed. The ion trap device is mounted on the removable sample holder, which interfaces with the fixed mounting bracket. This segmentation allows the sample to be quickly exchanged while the mounting bracket maintains thermal contact with the cryostat cold plate
Solution Approach 2:
The mounting bracket acts as an intermediary component between the cryostat cold plate and the ion trap device. It provides the thermal connection path from the cold plate through the bracket to the sample, while its detachable design enables quick sample exchange without compromising the thermal management capability
3Temperature
If the cryostat socket provides good thermal contact, then cooling efficiency is improved, but optical access may be compromised
Solution Approach 1:
The mounting bracket provides localized thermal contact at specific points where thermal connection is critical, rather than requiring complete enclosure. The bracket makes thermal contact at the base of the ion trap device while leaving the sides and top open, providing both cooling efficiency at the contact points and optical access from multiple directions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables quick and easy mounting and exchange of ion trap devices, maintaining good thermal contact and optical access, which is essential for efficient operation in cryogenic environments.
Implementation Method 1
contact pins resiliently received in the base plate
Implementation Method 2
rear side of the substrate is pressed onto the contact pins
Data Source
AI summary
A system includes: an ion trap device; an application board; a base plate arranged on the application board and having one or more through-holes; a substrate having a first side and a second side, the ion trap device being arranged on the first side and the second side being arranged on the base plate; electronic circuitry and/or electrical components arranged on the application board and configured to generate one or more signals for the ion trap device; and one or more conductive traces arranged on the application board and electrically coupled to the electronic circuitry and/or electrical components. The one or more conductive traces are routed to the base plate. An electrical connection is formed between the one or more conductive traces and the second side of the substrate via the one or more through-holes of the base plate.