Ionic Liquid Focus Ring Drive for Etching Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face complexity due to the need for electric drive mechanisms to adjust consumable parts, which can lead to increased risk of dust generation and complications in maintaining etching uniformity as parts like the focus ring thin due to plasma etching, affecting the positional relationship and etching process.
Innovation Solution
A substrate processing apparatus that uses an ionic liquid to drive consumable parts, such as a focus ring, through a container with a supply unit and drive unit, eliminating the need for electric drive mechanisms by utilizing buoyancy forces to adjust the focus ring's position in response to consumption, thereby maintaining etching uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an electric drive mechanism is used to adjust the focus ring position, then the etching uniformity can be maintained, but the device complexity increases and dust generation risk increases
Solution Approach 1:
The patent replaces the electric drive mechanism with a buoyancy-based positioning system. The focus ring is positioned using the buoyant force of gas bubbles introduced into the susceptor, eliminating motors and mechanical drive components. This substitution maintains the ability to adjust focus ring position for etching uniformity while reducing device complexity and dust generation from electric components.
Solution Approach 2:
The patent uses gas bubbles (pneumatic system) to drive the focus ring positioning. By controlling the volume and pressure of gas bubbles introduced into the susceptor beneath the focus ring, the system achieves precise positional adjustment without mechanical contact or electric drive mechanisms, thereby maintaining etching uniformity while simplifying the apparatus.
2Manufacturing precision
If an electric drive mechanism is used to adjust the focus ring position, then the etching uniformity can be maintained, but the risk of dust generation increases
Solution Approach 1:
The patent eliminates electric motors and mechanical drive mechanisms that generate dust through friction, wear, and component degradation. Instead, it uses a contactless buoyancy-based system where gas bubbles adjust the focus ring position, completely removing the source of dust generation while maintaining positioning precision for etching uniformity.
Solution Approach 2:
The patent introduces gas bubbles as an intermediary medium between the control system and the focus ring. These bubbles transmit the positioning force without mechanical contact, eliminating dust generation from direct mechanical or electric interactions while still achieving the necessary positional adjustment for uniform etching.
3Duration of action of moving object
If the focus ring thickness decreases due to plasma etching consumption, then the consumable part is used up, but the positional relationship and etching process are affected
Solution Approach 1:
The patent implements a dynamic positioning system where the focus ring position is continuously adjustable based on its consumption level. As the focus ring thins from plasma etching, the buoyancy-based system compensates by adjusting the gas bubble volume to maintain the correct positional relationship between the focus ring and the substrate, thereby preserving etching precision throughout the consumable's service life.
Solution Approach 2:
The system incorporates feedback control to monitor and adjust the focus ring position in response to consumption. By detecting changes in the focus ring thickness or position and dynamically adjusting the gas bubble pressure and volume, the system maintains optimal positional relationships despite the consumable nature of the focus ring, ensuring consistent etching quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the apparatus configuration, reduces the risk of dust generation, and effectively maintains etching characteristics by adjusting the focus ring's position using ionic liquid buoyancy, ensuring consistent etching performance without the need for electric motors.
Implementation Method 1
a drive unit configured to drive the consumable part by using the ionic liquid supplied from the supply unit
Data Source
AI summary
In a substrate processing apparatus, a processing chamber, in which a target substrate is disposed and substrate processing is performed on the target substrate, is provided. A consumable part is disposed in the processing chamber and consumed by the substrate processing. A supply unit is configured to supply an ionic liquid in response to a consumption of the consumable part. A drive unit is configured to drive the consumable part by using the ionic liquid supplied from the supply unit.