Ionic Wind Heat Dissipation Bridge for Compact Electronics
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Solution Overview
Problem
The miniaturization of electronic devices with heat dissipation functions is hindered by the difficulty in integrating high-performance heat dissipation means, such as heat dissipation fans, due to space constraints and high thermal resistance, particularly in narrow installations like vehicle communication modules.
Innovation Solution
An electronic device design incorporating a heat dissipation bridge that protrudes towards a heating element and is connected to a heat sink, utilizing ionic wind generation for convective heat transfer and heat conduction, enhancing cooling efficiency without the need for separate cooling fans or thick heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation fan is installed to improve cooling performance, then heat dissipation efficiency is improved, but device size increases and installation space requirements increase
Solution Approach 1:
The patent replaces the mechanical heat dissipation fan system with an ionic wind generation system that uses electrical fields to move air molecules. The ionic wind generator includes a discharge electrode and collector electrode that generate ions to create wind flow for heat dissipation without mechanical moving parts, thereby eliminating the need for bulky fan housings and drive mechanisms while maintaining effective cooling performance in compact spaces
Solution Approach 2:
The patent changes the operating parameters by using high voltage electrical fields instead of mechanical rotation to generate airflow. The ionic wind generator operates at voltages of several kilovolts to create sufficient ionization and wind pressure for effective heat dissipation, achieving the required air flow rates without the mechanical complexity and size of traditional fan systems
2Volume of moving object
If ionic wind generator is used to reduce device size, then device miniaturization is achieved, but air volume and cooling performance are insufficient
Solution Approach 1:
The patent combines the ionic wind generator with the heat sink into an integrated heat dissipation assembly. The collector electrode of the ionic wind generator is positioned to work in conjunction with the heat sink surface, creating a synergistic effect where the ionic wind directly impinges on the heat sink to enhance convective heat transfer, thereby achieving sufficient cooling performance in a compact configuration
Solution Approach 2:
The patent optimizes the dynamic characteristics of the ionic wind by adjusting the voltage, electrode spacing, and geometry to maximize airflow velocity and pressure. The discharge electrode configuration is designed to generate a concentrated ionic wind jet that maintains high velocity over the heat dissipation surface, ensuring adequate air volume and cooling effectiveness despite the compact size
3Temperature
If heat sink is made thicker to improve heat dissipation, then heat dissipation performance is improved, but device height and installation space increase
Solution Approach 1:
The patent replaces reliance on thick heat sink structures with an active ionic wind-driven convective cooling system. The ionic wind generator provides forced convection that significantly enhances heat transfer coefficients, allowing the use of thinner heat sinks while maintaining or improving heat dissipation performance. The electrical field-driven airflow compensates for the reduced thermal mass and surface area of thinner heat sink designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves cooling performance by simultaneously utilizing convective heat transfer from ionic wind and heat conduction through the heat dissipation bridge, effectively managing high thermal resistance in narrow spaces without noise or vibration, and can be applied to structures with electromagnetic wave shielding requirements.
Implementation Method 1
a heat dissipation means causing an ionic wind to flow into an inner space of the casing
Implementation Method 2
at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element to the heat sink
Implementation Method 3
The heat dissipation bridge exchanges heat with the ionic wind flowing in the inner space by protruding in a direction of the heating element
Data Source
AI summary
An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.