Integrated Passive Device With Opposed Solder Bumps for Thermal Routing
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Solution Overview
Problem
Existing semiconductor devices face challenges in managing thermal and electrical connectivity within dense packages, leading to increased thermal density and complexity, which current packaging technologies struggle to address effectively.
Innovation Solution
Incorporating an integrated passive device (IPD) with opposed solder bumps between the semiconductor device and the substrate, which provides both thermal and electrical connectivity, optimizing signal routing and thermal dissipation through the use of capacitors, inductors, and conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If modern packaging technologies (POP, FO) are used to increase device density, then semiconductor device density is improved, but thermal density increases and becomes harder to manage
Solution Approach 1:
The patent segments thermal management by providing multiple dedicated thermal paths through the substrate using through-substrate vias and thermal vias. Instead of relying on a single thermal path, the thermal management function is divided into multiple parallel pathways that distribute heat flow, allowing high device density while managing thermal density through distributed thermal conduction channels.
Solution Approach 2:
The patent transitions from planar thermal management to three-dimensional thermal management by routing thermal paths through the substrate thickness dimension. Through-substrate vias and thermal vias create vertical thermal conduction pathways, adding a depth dimension to heat dissipation that enables effective thermal management in high-density three-dimensional package structures.
2Adaptability or versatility
If more interconnections are added to support higher density, then device connectivity is improved, but package complexity increases
Solution Approach 1:
The patent implements multi-functionality by designing solder bumps and interconnection structures that simultaneously provide electrical connectivity and thermal conduction. The same via structures serve dual purposes: electrical signals and thermal management, eliminating the need for separate dedicated thermal pathways and reducing overall package complexity despite high connectivity requirements.
Solution Approach 2:
The patent merges electrical interconnection and thermal management functions into integrated structures. Through-substrate vias and solder bump arrays combine electrical signal routing with thermal conduction pathways, consolidating multiple functions into unified structures that reduce the number of discrete components and simplify package design.
3Temperature
If larger packages are used to accommodate thermal management structures, then thermal dissipation is improved, but device miniaturization is hindered
Solution Approach 1:
The patent embeds thermal management structures within the existing package volume by routing thermal paths through substrate layers and utilizing internal via structures. Thermal conduction pathways are nested within the substrate thickness and interconnection layers, utilizing the existing three-dimensional package volume efficiently without requiring external thermal management components that would increase overall package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IPD enhances PDN performance and thermal management, enabling smaller packages, improved signal integrity, and reduced electrical resistance, while minimizing the need for redundant connections.
Implementation Method 1
provides both thermal and electrical connectivity, optimizing signal routing and thermal dissipation
Implementation Method 2
optimizing signal routing and thermal dissipation through the use of capacitors, inductors, and conductive materials
Data Source
AI summary
A semiconductor device includes an integrated passive device coupled to a redistribution structure by a plurality of first bumps, and having a plurality of second bumps disposed opposite the plurality of first bumps, wherein the plurality of first and second bumps are thermally and/or electrically connected, and thus enable further thermal and/or electrical connections within or comprising the semiconductor device.