IPD Shielding Layer for EMI Isolation
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Solution Overview
Problem
High frequency semiconductor devices generate undesired electromagnetic interference (EMI) and radio frequency interference (RFI), which can interfere with the operation of adjacent circuit elements, posing a challenge for effective isolation in semiconductor packaging.
Innovation Solution
A semiconductor device with a shielding layer is formed over an encapsulant and electrically connected to a conductive channel in the IPD structure to isolate electrical devices from interference, using materials like Cu, Al, or stainless steel, and a seed layer for effective EMI and RFI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high frequency electrical devices are used in semiconductor packages, then electrical function performance is improved, but electromagnetic interference and radio frequency interference are generated that interfere with adjacent circuit elements
Solution Approach 1:
A shielding layer is introduced as an intermediary element between high frequency electrical devices and adjacent circuit elements. This shielding layer, formed of conductive material and electrically connected to a conductive channel in the IPD structure, acts as a mediator that blocks electromagnetic interference while allowing the high frequency devices to maintain their electrical function performance.
2Adaptability or versatility
If multiple IPDs are contained within one semiconductor package, then electrical function versatility is improved, but inter-device interference such as cross-talk increases
Solution Approach 1:
The patent segments the electromagnetic environment by introducing shielding layers that divide the package interior into isolated zones. Each IPD or electrical device can be individually shielded, allowing multiple devices to coexist in one package with enhanced electrical function versatility while minimizing inter-device interference through spatial segmentation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively isolates semiconductor devices from EMI and RFI, enhancing the reliability and performance of high-frequency applications by reducing cross-talk and interference between circuit elements.
Implementation Method 1
A shielding layer is formed over the encapsulant and electrically connected to a conductive channel in the IPD structure to isolate the first and second electrical devices from interference
Data Source
AI summary
A semiconductor device has an IPD structure formed over a substrate. First and second electrical devices are mounted to a first surface of the IPD structure. An encapsulant is deposited over the first and second electrical devices and IPD structure. A shielding layer is formed over the encapsulant and electrically connected to a conductive channel in the IPD structure. The conductive channel is connected to ground potential to isolate the first and second electrical devices from external interference. A recess can be formed in the encapsulant material between the first and second electrical devices. The shielding layer extends into the recess. An interconnect structure is formed on a second surface of the IPD structure. The interconnect structure is electrically connected to the first and second electrical devices and IPD structure. A shielding cage can be formed over the first electrical device prior to depositing encapsulant.