Irregular Vapor Chamber Wick Layout for Against-Gravity Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Vapor chambers with reduced dimensions in irregular shapes experience restricted cooling fluid flow due to smaller cross-sectional areas, inhibiting circulation and affecting heat dissipation efficiency, particularly when a heat source is positioned against gravity.
Innovation Solution
The vapor chamber design incorporates multiple longitudinally extending wick structures with varying lengths and configurations, including straight and bent designs, to enhance fluid circulation and improve heat dissipation by minimizing fluid circulation paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the vapor chamber is designed with reduced dimensions to accommodate compact electronic products, then the device can be made lighter and more compact, but the cross-sectional area of the wick structure is reduced which restricts cooling fluid flow and inhibits circulation
Solution Approach 1:
The wick structure is designed with varying cross-sectional areas at different locations along its length. The cross-sectional area is larger at portions where cooling fluid circulation is needed and smaller at other portions, allowing the wick to provide sufficient flow capacity in critical areas while maintaining overall compact dimensions of the vapor chamber.
2Shape
If the vapor chamber has an irregular shape to avoid obstructing nearby electrical components, then the device can be made more compact, but the circulation path for cooling fluid becomes longer and more complex
Solution Approach 1:
The wick structure is divided into multiple sections along its length, with each section having different cross-sectional areas tailored to the local requirements of the vapor chamber. This segmentation allows the wick to adapt to the irregular shape of the vapor chamber while maintaining efficient cooling fluid circulation in each segment.
3Ease of operation
If the cooling fluid must circulate against gravity in a vertically orientated vapor chamber, then the vapor chamber can be positioned with heat source at upper portion, but the flow of cooling fluid stagnates in reduced dimension portions
Solution Approach 1:
The cross-sectional area parameter of the wick structure is varied along its length to compensate for gravitational effects on cooling fluid circulation. In portions where cooling fluid must flow against gravity, the wick structure is designed with larger cross-sectional areas to reduce flow resistance and prevent stagnation, enabling the vapor chamber to operate effectively in vertical orientation with heat source at upper portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced wick structure configurations facilitate efficient heat dissipation by improving cooling fluid circulation, especially against gravity, thereby optimizing the performance of vapor chambers in compact electronic devices.
Implementation Method 1
The cooling fluid is evaporated into a gaseous state in the evaporation section, and then turns into a liquid state in the condensation section
Implementation Method 2
The cooling fluid is evaporated into a gaseous state in the evaporation section, and then turns into a liquid state in the condensation section
Implementation Method 3
The cooling fluid is evaporated into a gaseous state in the evaporation section, and then turns into a liquid state in the condensation section and is carried back to the section area by the wick structure
Data Source
AI summary
A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.


