Thermally Isolated IC Chip Portion for Rapid Temperature Drift Correction

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Solution Overview

Problem

Current methods for testing integrated circuits to prevent temperature drifts are time-consuming due to the need to heat wafers to multiple temperatures, significantly increasing manufacturing costs and time.

Innovation Solution

An integrated circuit chip design featuring a thermally insulated critical portion with heating resistors and a temperature sensor, allowing for rapid temperature changes within this portion, enabling quick testing and adjustment at multiple temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If wafers are heated to multiple temperatures for testing, then temperature drift correction is achieved, but testing time increases significantly

Engineering Contradiction:

Improvetemperature drift correctionVSAvoidtesting time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The chip is divided into a critical portion containing temperature-sensitive circuits and surrounded by trenches that provide thermal isolation. This segmentation allows the critical portion to be tested and adjusted for temperature drift independently from the rest of the chip, enabling rapid temperature cycling without heating the entire wafer.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heating resistors are placed locally within the critical portion surrounded by trenches, creating a localized heating zone. This allows temperature changes to be applied only to the critical circuits that need drift correction, rather than heating the entire wafer, significantly reducing testing time while maintaining correction effectiveness.

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If wafers are heated to multiple temperatures for testing, then temperature drift correction is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvetemperature drift correctionVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

By segmenting the chip into a thermally isolated critical portion, the patent enables rapid temperature testing that reduces manufacturing cycle time. This segmentation makes the temperature drift correction process more efficient and cost-effective compared to traditional whole-wafer heating methods.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Localized heating resistors within the trench-isolated critical portion enable targeted temperature adjustment during manufacturing. This local quality approach reduces energy consumption and testing time, thereby lowering manufacturing costs while achieving the required temperature drift correction.

Inventive Principle:

Principle #3Local quality

3Speed

If heating resistors are placed in the critical portion, then rapid temperature changes are achieved, but device complexity increases

Engineering Contradiction:

Improvetemperature change rateVSAvoidchip structure

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The critical portion is segmented and isolated by trenches, creating a compact structure that allows rapid temperature changes. The segmentation enables focused heating without the thermal mass of the entire chip, achieving fast temperature transitions while keeping the added structural complexity minimal and localized.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heating resistors are integrated locally within the critical portion, adding minimal complexity only where needed. The trenches provide thermal isolation with simple geometric structures, and the local heating approach avoids the complexity of whole-chip temperature control systems.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces testing time from minutes to milliseconds, enabling more comprehensive temperature stability adjustments and improving manufacturing efficiency and cost-effectiveness.

Implementation Method 1

heating resistors and a temperature sensor placed in said circuit portion

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

the temperature sensor is a PN junction diode

Methodology Applied

Scientific EffectPN junction temperature sensing: Diode

Implementation Method 3

trenches surrounding a critical portion of the circuit capable of making it sensitive to temperature variations

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS9607906B2Integrated circuit chip with corrected temperature drift

Publication Date: 2017.03.28 STMICROELECTRONICS (GRENOBLE 2) SAS

AI summary

An integrated circuit chip includes trenches at least partially surrounding a critical portion of a circuit that is sensitive to temperature variations. The trenches are locally interrupted in order to permit circuit connections to pass between the critical portion and an outer portion containing a remainder of the circuit. The critical portion includes heating resistors and a temperature sensor.