Semiconductor/Solid-State Device Testing/Measurement TRIZ Cases
- Wafer Level Package Molding Without Grinding
Pressurized molding exposes semiconductor chip tops without grinding, reducing process complexity and material selection constraints.
- Wafer Inspection Using Scattered Light for Metrology and Defect Classification
Metrology tools measure surface roughness via scattered light signals, resolving the trade-off between measurement precision and speed during inline monitoring.
- Thermal Dissipating Lead Frame for Semiconductor Hot Spot Management
A lead frame design positions specific thermal dissipating fingers closer to the die pad to conduct heat away from semiconductor hot spots.
- Semiconductor Electrode Pad Configuration for Kelvin Contact
Merging force and sense pads into one structure reduces chip area while maintaining measurement precision.
- Interposer With Active And Passive Pads For Semiconductor Chip Inspection
Active and passive pads on an interposer enable data input and power supply, resolving inspection challenges for high-performance chips with numerous bumps.
- Ferrofluid Alignment for 3D IC Chip Positioning
A ferrofluid layer supports a semiconductor chip on a substrate, enabling precise magnetic positioning of solder balls.
- Eddy Current Sensor Coils for Thin Film Detection
Nested inner and outer coils in a single eddy current sensor improve thin film detection accuracy without increasing device complexity or oscillation frequency.
- Semiconductor Chip Bond Area Segmentation for Probe Damage Prevention
Segmenting the metal pad isolates electrical testing from the bond area, preventing probe damage to bumps and eliminating rework requirements.
- Metrology Test Structure With Blocking Layer For Pattern Segmentation
A metrology test structure uses a blocking layer to segment complex patterns into simpler regions for focused measurement.
- Silicon Crystallization via Reflectivity-Based Energy Density Selection
A method calculates an optimum energy density index by measuring substrate reflectivity across visible wavelength ranges to determine laser annealing parameters.
- Multi-Tool Misregistration Measurement Parameter Configuration
A multi-tool parameter configuration system adjusts measurement parameters across different metrology tools to generate matched misregistration data sets for semiconductor wafers.
- SiC Wafer Interconnects via Direct Aerosol Jet Printing
Aerosol jet printing creates custom resistive interconnects on silicon carbide wafers, eliminating reticle steps and reducing production complexity.
- Semiconductor Pad Segmentation for Probe Mark Isolation
Segmenting the pad separates probe contact from wire bonding, eliminating interface pores to maintain signal reliability.
- Semiconductor Substrate Metal Contamination Detection via Oxide Film
A semiconductor substrate manufacturing method uses dry oxidation to form an oxide film for photoluminescence evaluation.
- Localized Energy Surface Planarization for Semiconductor Wafer Etching
A surface planarization system uses localized energy to create temperature patterns that drive selective etching rates across a semiconductor wafer.
- MOS Capacitor Interface State Density Measurement via Frequency-Dependent Series Resistance
A conductance technique models frequency-dependent series resistance to measure interface state density in MOS capacitor structures.
- Semiconductor Device Photocorrosion Suppression via Sensor Substitution
Replacing optical detection with infrared sensing suppresses photocorrosion defects while maintaining accurate substrate tracking.
- GaN Composite Substrate with Metal Oxide Protective Layer
A gallium nitride composite substrate uses a removable metal oxide layer to protect the surface during fabrication.
- UV Irradiance Monitoring via Thermal Signal Correlation
A spectral sensor detects UV source output by correlating chamber temperature with irradiance levels for real-time process control.
- Wafer-Level Die Bridge RDL Formation for High-Yield Interconnects
Forming redistribution layers on a carrier substrate before placing chips resolves manufacturing complexity and boosts yield.
- Package Substrate Measurement Terminal for High-Speed Signal Integrity
Relocating the measurement terminal from the mounting board to the package substrate eliminates stub structures that deteriorate signal quality.
- Multi-Chamber Bladder for CMP Wafer Temperature Control
Segmented bladder chambers supply independent cooling fluids to eliminate thermal gradients caused by friction variations, ensuring uniform planarization.
- Pattern-Selective Heating for Semiconductor Etch Uniformity
Local quality and intermediary principles enable selective heating via absorbing materials, resolving non-selective etch rate variations across wafer patterns.
- Distributed Voltage Network Circuit for Accurate Current Measurement
A distributed voltage network circuit calculates average voltage across multiple load areas using resistive interconnects and tap nodes.
- Shared Optical Detection for Substrate Processing Fluid Paths
A shared light irradiating unit moves along arranged flow passages to detect foreign matter, reducing apparatus size and manufacturing cost.
- Wafer-Level TSV Testing via Test Conductive Layer
A test conductive layer enables voltage measurement of through-silicon vias at the wafer stage before grinding.
- Statistical Measurement Model for Semiconductor Metrology
A statistical measurement model calculates process and structure parameters directly from measured training data.
- Semiconductor Package With Embedded Routing Traces
A semiconductor package embeds routing traces within a lead frame cavity to protect conductive paths from environmental contamination and mechanical damage.
- Detecting 25 nm Crystal Defects in Nitrogen-Doped Silicon Wafers
Heat treatment in oxygen atmosphere implants oxygen into crystal defects to make them detectable.
- Thermally Isolated IC Chip Portion for Rapid Temperature Drift Correction
A thermally isolated critical circuit portion with local heating resistors enables rapid temperature cycling within an integrated chip.
- Semiconductor Inspection Airflow Control for Wafer Contamination
Segmented ducts supply clean air to the inner substrate section, reducing foreign matter accumulation during rotation without increasing airflow disturbance.
- Spectroscopic Measuring Apparatus Microlens Spot Size Control
A spectroscopic measuring apparatus uses a microlens to enhance optical resolution and magnification for precise spectral signal acquisition.