Multi-Tool Misregistration Measurement Parameter Configuration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for measuring misregistration in semiconductor device manufacturing are inadequate in ensuring precise alignment of layers across multiple wafers, leading to inconsistencies and inefficiencies in the fabrication process.
Innovation Solution
A multiple-tool parameter set configuration and misregistration measurement method using machine-learning algorithms to analyze data sets from multiple metrology tools, adjusting parameters to generate matched misregistration data sets across different tools, ensuring consistent measurement across semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple metrology tools with different measurement parameters are used to measure misregistration, then measurement coverage and data quantity are improved, but measurement consistency and data comparability deteriorate
Solution Approach 1:
The patent transforms measurement data from different tools by adjusting parameters such as normalization factors, scaling factors, and offset values to make the data comparable. This involves changing the parameter space of the measurement data to achieve consistency across tools with different measurement configurations.
Solution Approach 2:
The patent introduces an intermediary processing layer that receives raw measurement data from multiple tools and transforms it into a standardized format. This intermediary step includes applying tool-specific correction factors and normalization procedures before the data is used for misregistration analysis.
2Measurement precision
If measurement parameters are adjusted to match data sets from different tools, then data consistency is improved, but system complexity increases
Solution Approach 1:
The patent implements feedback mechanisms where measurement data from multiple tools is continuously monitored and compared. Based on the comparison results, adjustment parameters are automatically updated to improve consistency. This closed-loop approach reduces the need for manual parameter tuning while maintaining data quality.
Solution Approach 2:
The system performs self-calibration by automatically determining optimal transformation parameters between different measurement tools. The measurement system adjusts its own parameters based on reference measurements and statistical analysis, reducing the need for external intervention and simplifying operation.
Data Source
AI summary
A multiple-tool parameter set configuration and misregistration measurement system and method useful in the manufacture of semiconductor devices including using a first misregistration metrology tool using a first set of measurement parameters to measure misregistration between at least two layers at multiple sites on a wafer, including a plurality of semiconductor devices, the wafer being selected from a batch of wafers including a plurality of semiconductor devices intended to be identical to corresponding semiconductor devices on all other wafers in the batch of wafers, thereby generating a plurality of first misregistration data sets, using a second misregistration metrology tool using a second set of measurement parameters to measure misregistration between the at least two layers at multiple sites on a wafer selected from the batch of wafers, thereby generating a plurality of second misregistration data sets, selecting an adjusted first set of modeled measurement parameters associated with the first misregistration data sets and an adjusted second set of modeled measurement parameters associated with the second misregistration data sets, thereby generating a matched misregistration data set and thereafter measuring misregistration between at least two layers of at least one additional wafer, selected from the batch of wafers, using at least one of the first misregistration metrology tool using the adjusted first set of modeled measurement parameters and the second misregistration metrology tool using the adjusted second set of modeled measurement parameters.