Semiconductor Chip Bond Area Segmentation for Probe Damage Prevention
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Solution Overview
Problem
In semiconductor chip manufacturing, testing probes frequently damage bumps during the testing process, leading to unreliable bonds between the chip and substrate, necessitating reworking and increased labor.
Innovation Solution
A semiconductor chip design featuring a testing area and a bond area with a polymer layer applied after testing, where a testing probe contacts the testing area, and a metal layer is exposed for bonding, allowing for reliable electrical testing and bonding without damaging the bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If testing probes contact the bumps for electrical testing, then electrical testing can be performed, but the bumps are damaged and bonding reliability deteriorates
Solution Approach 1:
The pad structure is segmented into two distinct functional areas: a testing area for electrical testing and a bond area for bonding. This segmentation allows the testing probe to contact only the testing area, preventing damage to the bump on the bond area, while still enabling complete electrical testing functionality.
Solution Approach 2:
An intermediate structure (the testing area pad) is introduced between the testing probe and the bump. The testing probe contacts the testing area pad rather than directly contacting the bump, serving as a mediator that enables electrical testing without transmitting mechanical damage to the bonding interface.
2Productivity
If testing probes repeatedly contact the bumps, then electrical testing can be performed, but reworking is required due to damaged bumps
Solution Approach 1:
By segmenting the pad into testing and bond areas, the structure enables repeated testing contacts without affecting the bond area, eliminating the need for reworking while maintaining testing efficiency.
Solution Approach 2:
The testing area is prepared in advance as a dedicated contact zone, allowing multiple testing operations to be performed on this preliminary structure without impacting the final bonding operation.
3Device complexity
If a single pad area is used for both testing and bonding, then device complexity is reduced, but testing causes damage to the bonding area
Solution Approach 1:
The pad is segmented into testing and bond areas within a single integrated structure, maintaining relative simplicity while preventing damage through functional separation.
Solution Approach 2:
Different local areas of the pad structure are assigned different functions: the testing area is designed for probe contact while the bond area is designed for bonding, allowing each region to optimize its specific function without compromising the other.
Data Source
AI summary
A semiconductor chip comprises a metal pad exposed by an opening in a passivation layer, wherein the metal pad has a testing area and a bond area. During a step of testing, a testing probe contacts with the testing area for electrical testing. After the step of testing, a polymer layer is formed on the testing area with a probe mark created by the testing probe. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad. During a step of testing, a testing probe contacts with the testing pad for electrical testing. After the step of testing, a polymer layer is formed on the testing pad with a probe mark created by the testing probe.