SiC Wafer Interconnects via Direct Aerosol Jet Printing
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Solution Overview
Problem
Existing methods for conductive ink interconnects in wafer circuit manufacturing are limited in customization and processing efficiency, requiring multiple steps and materials that can be simplified.
Innovation Solution
Direct application of conductive ink interconnects using additive manufacturing techniques such as aerosol jet printing and micro-syringe dispensing, allowing for precise patterning of resistive traces and interconnects on semiconductor substrates, eliminating the need for reticles and reducing production time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional conductive ink interconnect methods are used, then manufacturing process is established, but customization is limited and processing steps are multiple
Solution Approach 1:
The patent extracts and eliminates the reticle step from the traditional manufacturing process. By using direct aerosol jet printing to deposit conductive ink patterns without requiring reticles, the method reduces processing steps while maintaining manufacturing capability, directly addressing the contradiction between established manufacturing and process complexity
Solution Approach 2:
The patent changes the manufacturing approach from indirect (reticle-based photolithography) to direct (aerosol jet printing). This parameter change in the deposition method enables customization of interconnect patterns without being constrained by traditional reticle limitations, thereby improving adaptability while reducing process steps
2Productivity
If traditional interconnect manufacturing is used, then production is stable, but production time and cost are high
Solution Approach 1:
The patent performs preliminary pattern design and preparation in the form of digital data before the actual printing process. This allows for rapid customization and eliminates the need for physical reticle fabrication, reducing production time while maintaining stable production through automated aerosol jet printing
Solution Approach 2:
The patent replaces the mechanical reticle handling and photolithography system with an aerosol jet printing system. This substitution eliminates time-consuming reticle fabrication and alignment steps, directly improving productivity while reducing production time through direct digital-to-physical manufacturing
3Manufacturing precision
If conventional printing methods are used, then manufacturing is simple, but resolution is insufficient for submicron features
Solution Approach 1:
The patent employs dynamic control of the aerosol jet printing process, including real-time adjustment of printing parameters such as nozzle movement speed, aerosol flow rate, and substrate positioning. This dynamic control enables achievement of submicron resolution while maintaining the simplicity of the manufacturing process through software-controlled parameters rather than complex hardware modifications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables customized and efficient production of semiconductor devices with submicron resolution, reducing the complexity and cost of creating prototypes by directly printing interconnects on wafers, enhancing the integration of discrete devices with precise resistance values.
Implementation Method 1
aerosol jet printing
Implementation Method 2
micro-syringe dispensing
Data Source
AI summary
An improved silicon carbide wafer using direct application conductive ink interconnects positioned on printing connection pads. The conductive ink interconnected can be routed to form a custom length resistive trace for a device after fabrication and measurement of the device.