Package Substrate Measurement Terminal for High-Speed Signal Integrity

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Solution Overview

Problem

Existing semiconductor systems face challenges in measuring high-speed signal quality without compromising the signal integrity, leading to increased packaging area and costs, and prolonged development periods due to the use of measurement terminals that form extra stub structures on the signal transmission path.

Innovation Solution

A semiconductor apparatus design where a measurement terminal is connected to the signal wiring line on the package substrate, with a resistor and GND terminal provided on the main surface, allowing for high-speed signal measurement without deteriorating signal quality, and optimizing the placement to minimize area usage and development time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If measurement terminals are placed on the mounting board or interposer, then signal quality measurement is enabled, but signal quality deteriorates due to extra stub structures formed on the signal transmission path

Engineering Contradiction:

Improvesignal quality measurement capabilityVSAvoidsignal waveform deterioration

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The measurement terminal is extracted from the mounting board or interposer and relocated to the package substrate. This removes the harmful stub structure from the signal transmission path while preserving the measurement capability. The measurement terminal TE1 is connected to the signal wiring line SL on the package substrate through a via hole, eliminating the need for external measurement terminals that create impedance discontinuities.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The measurement terminal is moved from a two-dimensional plane (mounting board or interposer surface) to a three-dimensional integration within the package substrate structure. By utilizing the vertical dimension through via holes and integrating the measurement terminal within the package substrate layers, the solution eliminates the harmful stub effect while maintaining measurement functionality.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Measurement precision

If measurement terminals are placed on the mounting board or interposer, then signal quality measurement is enabled, but packaging area increases

Engineering Contradiction:

Improvesignal quality measurement capabilityVSAvoidmounting board area

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The measurement terminal function is merged with the package substrate structure. Instead of adding separate measurement terminals on the mounting board or interposer, the measurement terminal is integrated into the package substrate where it shares the same physical space and structural layers, thereby eliminating the need for additional mounting board area.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The package substrate serves multiple functions: it mounts the semiconductor chip, provides signal transmission pathways, and incorporates the measurement terminal for signal quality assessment. This multi-functionality eliminates the need for separate measurement terminal structures on the mounting board, reducing overall packaging area.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Measurement precision

If measurement terminals are placed on the mounting board or interposer, then signal quality measurement is enabled, but development period is prolonged

Engineering Contradiction:

Improvesignal quality measurement capabilityVSAvoiddevelopment period

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The measurement terminal is preliminarily integrated into the package substrate during the package substrate fabrication process, before the semiconductor chip is mounted and before the final assembly is completed. This preliminary integration of the measurement terminal TE1 with the signal wiring line SL and ground terminals TG1 eliminates the need for subsequent modifications or additions to the mounting board or interposer, thereby shortening the overall development period.

Inventive Principle:

Principle #10Preliminary action

4Measurement precision

If measurement terminals are placed on the mounting board or interposer, then signal quality measurement is enabled, but system cost increases

Engineering Contradiction:

Improvesignal quality measurement capabilityVSAvoidsystem cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The measurement terminal functionality is merged into the package substrate manufacturing process. By incorporating the measurement terminal TE1, signal wiring line SL, and ground terminals TG1 as integrated components during package substrate fabrication, the solution eliminates the need for separate measurement terminal components and their associated assembly costs, thereby reducing overall system cost.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11658081B2Semiconductor apparatus and semiconductor device

Publication Date: 2023.05.23 RENESAS ELECTRONICS CORP

AI summary

A semiconductor apparatus includes a mounting board, a system on chip (SOC) package and a memory package which are provided on the mounting board. The SOC package includes a semiconductor chip and a package substrate on which the semiconductor chip is mounted. The semiconductor apparatus further includes a signal wiring line through which a signal between the semiconductor chip and the memory package is transmitted, being provided on the package substrate and in the mounting board and a measurement terminal connected to the signal wiring line on main surface of the package substrate.