Isolated Semiconductor Package Layout for Higher Creepage Distance
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Solution Overview
Problem
Existing semiconductor devices lack sufficient voltage insulation between the control and drive elements, which are often required to operate at different source voltages.
Innovation Solution
A semiconductor device configuration featuring a conductive support member with spaced die pads and insulating parts to transmit signals while providing electrical insulation, along with a sealing resin that covers the elements, increasing the creepage distance between terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the control element and drive element are included in a single package with different source voltages, then integration is improved, but voltage insulation between conduction paths deteriorates
Solution Approach 1:
An insulating part is introduced as an intermediary component between the control element conduction path and the drive element conduction path. This insulating part includes an insulating substrate that physically separates the two conduction paths and prevents electrical breakdown, thereby maintaining voltage insulation while allowing both elements to coexist in a single package.
Solution Approach 2:
The package is segmented into distinct regions: a control element region and a drive element region, separated by the insulating part. This segmentation creates independent conduction paths with different source voltages that do not interfere with each other, enabling integrated packaging while maintaining proper voltage insulation.
2Ease of manufacture
If the conductive support member is exposed on the third side face, then manufacturing is simplified, but insulation distance between terminals deteriorates
Solution Approach 1:
A sealing resin is applied to cover the conductive support member on the third side face, creating an insulating barrier. This resin layer maintains the required insulation distance between terminals while allowing the conductive support member to remain exposed for manufacturing purposes, thus resolving the contradiction between manufacturing simplicity and insulation requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances voltage insulation by ensuring electrical isolation between input-side and output-side circuits, thereby increasing the insulation distance and further enhancing voltage insulation.
Implementation Method 1
an insulating part that transmits a signal between the input-side circuit and the output-side circuit, while providing electrical insulation between the input-side circuit and the output-side circuit
Implementation Method 2
a sealing resin covering at least a portion of the conductive support member, the first semiconductor element and the second semiconductor element
Implementation Method 3
a conductive support member including a first die pad and a second die pad spaced apart from the first die pad
Data Source
AI summary
A semiconductor device includes a conductive support member with first and second die pads, a first semiconductor element on the first die pad, a second semiconductor element on the second die pad for forming a first output-side circuit, and a sealing resin. The first semiconductor element includes a circuit part forming an input-side circuit, and an insulating part that transmits a signal between the input-side and the first output-side circuits, while providing electrical insulation between the input-side and the first output-side circuits. The sealing resin includes first and second side faces spaced apart in an x direction and a third side face perpendicular to a y direction. The conductive support member includes input-side terminals protruding from the first side face and first output-side terminals protruding from the second side face. The conductive support member is not exposed on the third side face.