Isolation Element for Signal Distortion in Semiconductor Packages

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Solution Overview

Problem

Different electric paths in semiconductor device packages have varying operational requirements, leading to interference and signal distortions when connected, particularly when busy paths are connected to idle paths, causing increased load, noise, and interference.

Innovation Solution

Incorporating an isolation element in the electric paths to separate the package pin from an isolated portion, which can be implemented using resistors or switches to reduce current and minimize capacitive or inductive load, thereby reducing signal distortions and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple electric paths are connected to share a common package pin, then the device complexity is reduced and pin utilization is improved, but signal distortion and interference increase due to capacitive and inductive loads from idle paths

Engineering Contradiction:
Improvepin utilizationVSAvoidsignal distortion
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

An isolation element (resistor or switch) is inserted as an intermediary component in the electric path between the package pin and the functional unit. This intermediary blocks or reduces the capacitive and inductive coupling between idle and busy paths, eliminating signal distortion while preserving the shared pin architecture.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The electric path is segmented into two sections by the isolation element: one section connected to the package pin and another section connected to the functional unit. This segmentation allows the idle portion of the path to be electrically isolated from the active signal path, preventing interference while maintaining structural simplicity.

Inventive Principle:
Principle #1Segmentation

2Object-affected harmful factors

If isolation elements are added to electric paths to reduce signal distortion, then signal quality is improved, but the device complexity and number of components increase

Engineering Contradiction:
Improvesignal distortionVSAvoidnumber of components
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The isolation element serves multiple functions simultaneously: it acts as a capacitor for AC signal isolation, a resistor for DC path definition, and can be controlled as a switch for dynamic path management. This multi-functionality reduces the need for additional dedicated components, minimizing the increase in device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The isolation element automatically performs its isolation function based on the operational state of the electric path without requiring external control circuitry. When the path is idle, the isolation element passively blocks capacitive coupling; when active, it allows signal transmission, thereby self-managing the isolation requirement.

Inventive Principle:
Principle #25Self-service

3Object-affected harmful factors

If isolation elements are used to separate busy and idle electric paths, then noise and interference are reduced, but power consumption increases due to additional circuit elements

Engineering Contradiction:
ImprovenoiseVSAvoidpower consumption
Core Design Contradiction:
Object-affected harmful factorsVSUse of energy by moving object

Solution Approach 1:

When using switchable isolation elements, the system periodically or dynamically activates the isolation function only when needed (i.e., when transitioning between busy and idle states). During steady-state operation, the isolation element remains inactive, minimizing its power consumption impact while still providing noise reduction when required.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The patent employs simple, low-cost isolation elements such as resistors or small switches that consume minimal power. These elements are designed to be simple and inexpensive, accepting some power loss as a trade-off for achieving noise reduction without requiring complex, high-power isolation mechanisms.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

4Device complexity

If shared package pins are used to connect multiple functional units, then the number of pins is reduced, but current load and interference increase when multiple paths are simultaneously active

Engineering Contradiction:
Improvenumber of pinsVSAvoidcurrent load
Core Design Contradiction:
Device complexityVSPower

Solution Approach 1:

The isolation element is made dynamically controllable, allowing the system to adapt the electric path configuration in real-time. When multiple functional units need to operate simultaneously, the isolation element can switch to connect or disconnect paths as needed, dynamically managing current load distribution and preventing overload on shared pins.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The isolation element improves signal quality by reducing distortions and power consumption, and can be efficiently implemented using passive or active circuit elements, effectively isolating idle paths from busy paths to prevent noise and capacitive/inductive loads.

Implementation Method 1

an isolation element in the first electric path. The isolation element separates the first package pin from an isolated portion in the first electric path, wherein the isolated portion is located between the isolation element and the first functional unit, and the isolation element is configured to reduce current between the first package pin and the isolated portion in the first electric path

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Data Source

PatentUS11270931B2Isolating electric paths in semiconductor device packages
Publication Date: 2022.03.08 RAMBUS INC
  • US11270931B2 patent drawing
  • US11270931B2 patent drawing
  • US11270931B2 patent drawing

AI summary

Methods, systems, and apparatus for reducing power consumption or signal distortions in a semiconductor device package. The semiconductor device package includes a semiconductor device, a first electric path, a second electric path, and an isolation element in the first electric path. The second electric path is electrically connected to the first electric path and a functional unit of the device. The isolation element separates an isolated portion in the first electric path from the second electric path, where the isolation element is configured to reduce current in the isolated portion when a signal is passing through the second electric path.