Process Kit Rings with Concave Convex Surfaces for TiW Film Adhesion

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Solution Overview

Problem

High stress compressive films, such as titanium-tungsten (TiW) alloy films, often peel off from process kit components in substrate processing chambers, leading to processing delays and increased maintenance costs due to coefficient of thermal expansion (CTE) mismatch and deposition issues.

Innovation Solution

The use of titanium-composed process kits with specific geometric designs, including concave and convex surfaces, and tapered protrusions, which align and support rings to prevent material deposition on small radius areas, reducing peeling and extending the processing lifetime of components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high stress compressive films are deposited on process kit components, then film deposition is achieved, but film peeling occurs due to CTE mismatch

Engineering Contradiction:
Improvefilm adhesionVSAvoidfilm peeling
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by creating specific geometric features (concave and convex surfaces) at critical locations on process kit components. These localized geometric modifications are designed to control film deposition patterns and reduce peeling at specific high-stress areas where CTE mismatch causes problems, rather than uniformly modifying the entire component surface.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes curvature principles by incorporating concave and convex surfaces on process kit components. These curved geometric features modify the deposition geometry and stress distribution, helping to prevent film peeling by creating favorable surface profiles that accommodate thermal expansion differences and reduce stress concentration at sharp edges.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If process kit components are periodically inspected and replaced, then component reliability is maintained, but processing delays occur

Engineering Contradiction:
Improvecomponent reliabilityVSAvoidprocessing delays
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-modifying process kit components with specific geometric features (concave/convex surfaces, tapered protrusions) before they are installed in the deposition chamber. These pre-engineered geometric modifications are designed to prevent film peeling issues before they occur, thereby extending component life and reducing the frequency of inspections and replacements, which eliminates processing delays associated with maintenance schedules.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If conventional process kit geometry is used, then manufacturing is simple, but material deposition on small radius areas causes peeling

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidresistance to peeling
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent resolves this contradiction by applying local quality modifications only to specific critical areas of the process kit components. Rather than redesigning the entire component geometry, localized concave and convex surfaces are introduced at areas prone to peeling, while maintaining the overall simple conventional geometry for ease of manufacture. This selective approach adds minimal manufacturing complexity while significantly improving peeling resistance.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The described process kits effectively reduce material peeling and deposition on process kit components, thereby extending their processing lifetime, improving tool uptime, and reducing maintenance costs in TiW film deposition processes.

Implementation Method 1

High stress compressive films, for example titanium-tungsten (TiW) alloy films, are generally deposited in process chambers adapted for performing various deposition, etch, and thermal processes

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS10115573B2Apparatus for high compressive stress film deposition to improve kit life
Publication Date: 2018.10.30 APPLIED MATERIALS INC
  • US10115573B2 patent drawing
  • US10115573B2 patent drawing
  • US10115573B2 patent drawing

AI summary

Apparatus for extending process kit components lifetimes are disclosed. In some embodiments, a process kit includes: a first ring having an inner wall defining an inner diameter, an outer wall defining an outer diameter, an upper surface between the inner wall and the outer wall, and an opposing lower surface between the inner wall and the outer wall, wherein a first portion of the upper surface proximate the inner wall is concave, and wherein a second portion of the upper surface extends horizontally away from the first portion; and a second ring having an upper surface and an opposing lower surface, wherein a first portion of the lower surface is configured to rest upon the second portion of the first ring, wherein a second portion of the lower surface is convex and extends into but does not touch the concave first portion of the upper surface of the first ring.