Backing-Free Label Transfer Mechanism for Complex Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing label application methods generate significant waste due to the use of paper or material backings and are inefficient for applying labels to substrates of various shapes and sizes, including three-dimensional objects.
Innovation Solution
A method that applies labels directly to substrates without a backing material, utilizing a transfer mechanism with a diaphragm constructed from flexible materials like silicone or fluorinated polymers, which can contour to the substrate's shape, and includes an ink layer and binding layer that are dried and cured before application, using a conveyer belt or sheet feed system for repeated use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a paper or material backing is used in label application, then the label structure is stable and easy to handle, but waste is generated and the ability to contour to complex substrate shapes is limited
Solution Approach 1:
The patent removes the traditional paper or material backing from the label structure, extracting only the essential functional components (adhesive layer, release layer, indicium) to achieve direct application to substrates without waste generation while maintaining the ability to contour to complex shapes
Solution Approach 2:
The patent employs a flexible release layer and thin adhesive structure that can conform to various substrate geometries including three-dimensional objects, eliminating the need for rigid backing material while maintaining structural integrity and adaptability
2Productivity
If a traditional label with backing material is used, then the labeling process is simple, but efficiency for various substrate shapes and sizes is reduced
Solution Approach 1:
The patent creates a universal label application system using a conveyer belt or sheet feed mechanism that can accommodate substrates of various shapes and sizes, including three-dimensional objects, through a single repeatable process cycle, thereby improving productivity across different application scenarios
Solution Approach 2:
The patent implements a continuous labeling process where the transfer mechanism is repeatedly applied to substrates in sequence, with the conveyer belt or sheet feed system enabling uninterrupted operation for high-volume production across different substrate types
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces waste, enhances the ability to apply labels to complex shapes, and allows for efficient, repeatable application of labels to substrates of different sizes and dimensions, improving the overall efficiency and effectiveness of the labeling process.
Implementation Method 1
a transfer mechanism with a diaphragm constructed from flexible materials like silicone or fluorinated polymers, which can contour to the substrate's shape
Implementation Method 2
an ink layer and binding layer that are dried and cured before application
Implementation Method 3
a binding layer that are dried and cured before application
Data Source
Figure 1
Figure 2
Figure 3
AI summary
According to an aspect, the present invention is directed to a method for applying a label to a substrate. The method includes applying an ink layer to a transfer mechanism; applying a binding layer to the ink layer; and contacting the binding layer to the substrate such that the binding layer and the ink layer are substantially removed from the transfer mechanism.