Laminate Package Internal Overmold Moisture Protection
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Solution Overview
Problem
Conventional semiconductor packages are vulnerable to reliability failures due to moisture condensation and contamination in varying temperature and humidity conditions, and they limit integration levels and thermal management, especially in high-frequency applications.
Innovation Solution
A laminate-based package with an internal overmold configuration, featuring a base substrate, perimeter wall, electronic components, and a mold compound, which separates signal transmission and thermal management, providing enhanced reliability and integration through dual signal transition planes and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air-cavity package configuration is used to improve high frequency performance, then signal transmission quality is improved, but reliability deteriorates due to moisture condensation and contamination vulnerability
Solution Approach 1:
The package is divided into distinct functional regions: an enclosed cavity for signal transmission and an overmold region for environmental protection. The perimeter wall separates these regions, allowing the cavity to maintain air-cavity benefits while the overmold provides moisture and contamination protection to the electronic components mounted on the base substrate.
Solution Approach 2:
The package combines multiple materials with different properties: the base substrate provides structural support and electrical connectivity, the perimeter wall provides mechanical enclosure, and the mold compound provides environmental protection. This composite structure allows simultaneous achievement of signal transmission quality and reliability in harsh environments.
2Adaptability or versatility
If only one side of the package is used for signal transmission to reduce cost, then manufacturing cost is reduced, but integration level deteriorates
Solution Approach 1:
The invention transitions from single-sided signal transmission to dual-sided signal transmission by utilizing both the front side (with electronic components in the cavity) and the back side (with base metal structures) of the base substrate for signal transmission. This dimensional expansion of signal pathways enables higher integration levels without excessive complexity increase.
3Reliability
If thermal management and signal transmission are supported on the same side to simplify structure, then device complexity is reduced, but high frequency performance deteriorates
Solution Approach 1:
The package structure segments thermal management and signal transmission functions into different spatial zones. Thermal management is handled primarily through the base substrate and perimeter wall structures, while signal transmission occurs through the enclosed cavity and dual signal transition planes. This functional segmentation allows both high frequency performance and thermal management to operate independently without interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate-based package with an internal overmold improves reliability in harsh environments by encapsulating electronic components and separating signal transmission and thermal management, enhancing high-frequency performance and integration levels.
Implementation Method 1
The mold compound resides over the internal side of the base substrate body and within the cavity, so as to encapsulate the at least one electronic component
Implementation Method 2
The at least one thermal management component is thermally coupled to the at least one electronic component and conducts heat generated from the at least one electronic component toward the external side of the base substrate body
Data Source
AI summary
The present disclosure relates to a microelectronic package, which includes a base substrate, a perimeter wall, an electronic component, and a mold compound. The perimeter wall extends from a periphery of the base substrate to form a cavity that is over the base substrate and within the perimeter wall. The electronic component is mounted on the base substrate and exposed to the cavity. The electronic component is thermally coupled to a thermal management component, which extends through the base substrate and conducts heat generated from the electronic component. The electronic component is also electrically coupled to a wall signal via, which extends through the perimeter wall and transmits signals. The mold compound resides over the base substrate and within the cavity, so as to encapsulate the electronic component.