Laminate Substrate Embedded Electrical Pathway for Package Density
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Solution Overview
Problem
Existing electronic package systems require wide spacing between devices due to the need for traces and vias on the system board to connect multiple packages, which limits the density of device mounting on printed circuit boards.
Innovation Solution
An integrated device package with a laminate substrate that includes an embedded electrical pathway, such as a metal trace, to connect common terminals within the substrate, allowing for more efficient routing of signals and reducing the need for surface traces, enabling a higher density of package mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traces and vias are used on the system board to connect multiple packages, then electrical connections between packages are achieved, but wide spacing between devices is required which limits mounting density
Solution Approach 1:
The patent merges the electrical connection function into the package substrate itself by integrating conductive traces and vias within the laminate substrate. This combines the package mounting function with the electrical interconnection function, eliminating the need for separate system board traces and vias, thereby reducing the spacing required between packages while maintaining reliable electrical connections.
Solution Approach 2:
The patent moves the electrical connection pathways from the two-dimensional surface of the system board into the three-dimensional structure of the laminate substrate. By embedding conductive elements within multiple layers of the substrate, the electrical connections are established in the vertical dimension, freeing up horizontal space on the system board and enabling closer package placement.
2Reliability
If surface traces are used to connect terminals, then electrical pathways are established, but extensive space is consumed on the system board
Solution Approach 1:
The patent extracts the electrical pathway function from the system board and relocates it to the package substrate. By taking out the trace and via structures from the system board and embedding them within the laminate substrate, the system board space is freed up, allowing for higher device density while maintaining electrical connectivity between terminals.
3Reliability
If multiple packages are mounted with standard spacing, then electrical connections are maintained, but device density is limited
Solution Approach 1:
The patent combines the package substrate with the electrical interconnection structure, merging what were previously separate functions into a single integrated component. This integration allows packages to be placed closer together while maintaining stable electrical connections through the embedded conductive pathways within the laminate substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the mounting of a larger number of devices or packages with reduced space requirements on the system board, as the embedded electrical pathways within the laminate substrate facilitate closer placement of packages without the need for extensive surface traces.
Implementation Method 1
a second layer that has a conductive element, a first via that electrically connects the first terminal to the conductive element, and a second via that electrically connects the second terminal to the conductive element
Implementation Method 2
The first conductive plate can include a thermally conductive paddle. The thermally conductive paddle can be exposed on a bottom surface of the laminate substrate
Data Source
AI summary
A package with a laminate substrate is disclosed. The laminate substrate includes a first layer with a first terminal and a second terminal. The laminate substrate also includes a second layer with a conductive element. The laminate substrate further includes a first via and a second via that electrically connect the first terminal to the conductive element and the second terminal to the conductive element, respectively. The package can include a die mounted on and electrically connected to the laminate substrate.