Laminated Ceramic Capacitor Electrode Resin for Dielectric Protection
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Solution Overview
Problem
Multilayer ceramic capacitors with a three-layer conductive resin configuration have high manufacturing costs and varying cohesive forces due to random void distribution, leading to reduced mechanical strength.
Innovation Solution
A multilayer ceramic capacitor design featuring flat-shaped metal fillers in the electrically conductive resin layer with controlled voids on their surfaces, which preferentially breaks under stress rather than the dielectric layers, enhancing mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a three-layer configuration is used in the electrically conductive resin layer, then electrical conductivity is improved, but manufacturing cost increases and cohesive force varies due to random void distribution
Solution Approach 1:
The invention changes the fundamental parameter of the resin layer from a multi-layer configuration to a single-layer configuration with controlled void distribution. By altering the structural parameter from three layers to one layer and controlling the void amount to be 10% or less, the patent achieves electrical conductivity while reducing manufacturing complexity and cost.
Solution Approach 2:
The invention applies local quality control by specifically managing the void distribution within the single resin layer. By controlling the void amount to be 10% or less and ensuring uniform distribution, the patent creates localized quality improvements that enhance both electrical conductivity and mechanical strength without requiring multiple layers.
2Ease of manufacture
If voids are randomly distributed in the electrically conductive resin layer, then manufacturing is simplified, but cohesive force varies and mechanical strength decreases
Solution Approach 1:
The invention changes the parameter of void distribution from random to controlled and uniform. By specifying that the void amount should be 10% or less and should be uniformly distributed throughout the resin layer, the patent transforms the manufacturing process into one that produces consistent mechanical strength while remaining relatively simple to implement.
Solution Approach 2:
The invention creates a standardized model for void distribution that can be replicated across all resin layers. By establishing the specific parameter of 10% or less void amount with uniform distribution, the patent creates a copyable manufacturing standard that ensures consistent mechanical strength across production batches.
3Reliability
If void amount in the resin layer is increased, then electrical conductivity improves, but mechanical strength and reliability decrease
Solution Approach 1:
The invention optimizes the critical parameter of void amount by setting it to 10% or less. This parameter change creates a balance point where the resin layer maintains sufficient electrical conductivity through controlled void presence while preserving mechanical strength through limited void quantity and uniform distribution.
Solution Approach 2:
The invention ensures continuous useful action by maintaining a balance between void presence for conductivity and void limitation for strength. By keeping void amount at 10% or less with uniform distribution, the patent ensures that the resin layer continuously provides both electrical conductivity and mechanical strength without intermittent failure points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves mechanical strength by controlling crack propagation in the resin layer, reducing stress on the dielectric layers and maintaining capacitor integrity under thermal and mechanical stress.
Implementation Method 1
an electrically conductive resin layer provided on the base electrode layer and including a thermosetting resin and a metal filler
Implementation Method 2
the metal filler in the electrically conductive resin layer is a flat-shaped filler having a flat shape, and a void is provided on a surface of the flat-shaped filler
Data Source
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AI summary
Provided is a laminated ceramic capacitor having high mechanical strength. This laminated ceramic capacitor 1 comprises: a laminated body 2 including a plurality of dielectric layers 5 that are laminated; a first internal electrode layer 6a disposed above the plurality of dielectric layers 5 and exposed at a first end surface E1; a second internal electrode layer 6b disposed above the plurality of dielectric layers 5 and exposed at a second end surface E2; a first external electrode 20a disposed above the first end surface E1; and a second external electrode 20b disposed above the second end surface E2. The first external electrode 20a and the second external electrode 20b include: an underlying electrode layer 21 containing a metal component; a conductive resin layer 22 disposed above the underlying electrode layer 21 and containing a thermosetting resin 38 and a metal filler 30; and a plating layer disposed above the conductive resin layer 22. The metal filler 30 of the conductive resin layer 22 is a flat filler having a flat shape. A void 40 is provided on the surface of the flat filler.