Laminated Circuit Substrate with Embedded Conductor Pattern
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Solution Overview
Problem
Circuit substrates with multilayer structures face challenges in maintaining high frequency characteristics due to conductor patterns in contact with resin layers having high dielectric constants and loss tangents, such as liquid crystal polymers, which limit their effectiveness in reducing thickness and increasing frequency and speed.
Innovation Solution
A stacked body configuration featuring a softer first resin layer with a lower dielectric constant, such as fluororesin, and a harder second resin layer, like liquid crystal polymer, where the conductor pattern is partially embedded in the first resin layer, enhancing high frequency characteristics and shape stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a liquid crystal polymer layer is used as the insulating base material to reduce thickness, then the thickness of the transmission line portion is reduced, but the dielectric constant and dielectric loss tangent increase, degrading high frequency characteristics
Solution Approach 1:
The insulating base material is divided into multiple layers: a first insulating layer made of fluororesin with low dielectric constant and loss tangent for high frequency performance, and a second insulating layer made of liquid crystal polymer for shape stability. This segmentation allows each layer to fulfill its specific function without compromise.
Solution Approach 2:
Different regions of the insulating base material are assigned different material properties. The first insulating layer in contact with the conductor pattern uses fluororesin with locally optimized low dielectric constant and loss tangent, while the second layer uses liquid crystal polymer for mechanical support, creating local quality differentiation.
2Reliability
If a soft fluororesin layer is used to improve flexibility and high frequency characteristics, then the dielectric constant and dielectric loss tangent decrease, but the overall shape stability deteriorates
Solution Approach 1:
The insulating base material is segmented into a first layer of soft fluororesin for high frequency characteristics and a second layer of harder liquid crystal polymer for shape stability, allowing each segment to perform its specialized function.
Solution Approach 2:
The patent uses a composite structure combining fluororesin and liquid crystal polymer layers, leveraging the complementary properties of both materials: fluororesin provides low dielectric constant and loss tangent, while liquid crystal polymer provides mechanical strength and shape retention.
3Ease of manufacture
If the conductor pattern is in contact with a resin layer having high dielectric constant and high dielectric loss tangent, then the manufacturing process is simplified, but the high frequency characteristics improvement effect is small
Solution Approach 1:
The first insulating layer in direct contact with the conductor pattern is made of fluororesin with locally optimized low dielectric constant and loss tangent properties, ensuring high frequency performance at the critical interface between conductor and insulator.
Solution Approach 2:
The insulating structure is segmented so that only the first layer adjacent to the conductor pattern uses fluororesin for high frequency performance, while the second layer can use liquid crystal polymer for mechanical support, optimizing both electrical and mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of stacked bodies with improved high frequency characteristics and shape retention, allowing for thinner, more flexible circuit substrates with reduced transmission loss and increased stability.
Implementation Method 1
stacking and heat-pressing a plurality of the stacked sheets to cause at least a portion of the conductor foil to be embedded in the first resin layer
Data Source
AI summary
A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.