Laminated Imprint Mold Blank for Precise Etching Depth Control
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Solution Overview
Problem
Existing imprint mold fabrication methods face challenges in achieving high accuracy for concave-convex shapes due to difficulties in controlling digging depth and uniformity, and the design and manufacturing processes are complicated, leading to potential substrate damage and inaccurate pattern transfer.
Innovation Solution
A stacked body comprising a substrate made of CaO, La2O5, and BaO, with a functional layer and an etching mask layer, allowing precise etching to form a desired concave-convex shape without complicating the process, using fluorine- and chlorine-containing gases for etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thin film pattern is used as a mask for etching the substrate, then a desired concave-convex shape can be formed on the substrate, but it is not easy to control the digging depth with high accuracy and the recesses cannot be made uniform
Solution Approach 1:
The patent introduces an intermediary layer (resist film) between the mask pattern and the substrate. This intermediary layer acts as a buffer that allows precise control of etching depth. The mask pattern is formed on the intermediary layer, which is then etched to transfer the pattern to the substrate with controlled depth, solving the problem of inaccurate depth control when using thin film masks directly on the substrate.
2Manufacturing precision
If multiple two-layer films are stacked to control digging depth, then the etching depth can be adjusted, but the design and manufacturing processes become very complicated
Solution Approach 1:
The patent changes the parameter of using a single thick intermediary layer instead of multiple thin layers. This single layer approach maintains the ability to control etching depth while significantly simplifying the design and manufacturing processes. The thickness of the single intermediary layer is optimized to achieve the desired etching depth control without requiring complex multi-layer stacking.
3Manufacturing precision
If the lower layer is removed by etching to achieve the desired shape, then the substrate is exposed, but the substrate is inevitably damaged
Solution Approach 1:
The patent applies beforehand cushioning by forming a protective layer (intermediary layer) on the substrate before etching. This protective layer cushions the substrate during the etching process, preventing direct damage to the substrate while allowing the desired recess shape to be formed. The protective layer remains in place throughout the etching process and can be removed afterward without having caused substrate damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of an imprint mold with high accuracy and simplicity, facilitating the manufacture of optical and electronic components with precise fine patterns.
Implementation Method 1
etching the functional layer; and removing the etching mask pattern
Data Source
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Figure 3(a)~3(i)
Figure 4(j)~4(p)
AI summary
Provided is a laminated body that is suitably used as a blank for an imprint mold capable of obtaining a desired uneven shape with high accuracy without complicating a design process and a manufacturing process. The laminated body 10 comprises: a substrate 1 that contains at least one of CaO, La2O3, Nb2O5, and BaO; a functional layer 2 that is provided on the substrate 1; and an etching mask layer 3 that is provided on the functional layer 2.