Laminated Electronic Component Via Structure to Suppress Conductor Protrusion
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Solution Overview
Problem
In the manufacturing process of electronic components with laminated insulating layers, the difference in shrinkage rates between interlayer connection conductors and insulating layers can cause the conductors to protrude, leading to short circuits, especially when the layers are thin or when conductors are continuous in the thickness direction.
Innovation Solution
The electronic component design includes a first conductor with a cavity shifted towards either side of a tapered through hole, allowing deformation to prevent protrusion and reducing the risk of short circuits by increasing the contact area and volume of the cavity, which can be formed in the central part or at the outer edge of the conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the interlayer connection conductor is filled in the through hole and laminated with insulating layers, then the electrical connection between layers is achieved, but the conductor protrudes from the insulating layer due to different shrinkage rates
Solution Approach 1:
The cavity is formed in the interlayer connection conductor before lamination, in advance preparing space to receive the protruding portion. This preliminary action prevents the conductor from protruding beyond the insulating layer surface after lamination, while maintaining electrical connection functionality.
Solution Approach 2:
The cavity acts as a cushioning space that absorbs the protrusion of the conductor caused by differential shrinkage during lamination. By providing this beforehand cushioning space, the conductor is prevented from causing short circuits while maintaining reliable electrical connection.
2Volume of moving object
If the insulating layer is made thin to reduce component size, then the integration density is improved, but the possibility of short circuit increases due to conductor protrusion
Solution Approach 1:
The cavity is formed in advance in the conductor to receive the protruding portion that would otherwise cause short circuits in thin insulating layers. This allows the use of thinner insulating layers while maintaining reliability by preventing conductor protrusion-induced short circuits.
3Reliability
If the continuous interlayer connection conductors are formed in multiple insulating layers, then the electrical connectivity is improved, but the protrusion amount increases and short circuit possibility increases
Solution Approach 1:
Cavities are formed in the continuous interlayer connection conductors before lamination to receive the protruding portions. This preliminary preparation allows continuous conductors to maintain electrical connectivity across multiple layers without causing short circuits, as the cavities absorb the protrusion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses conductor protrusion from the insulating layer, reducing the likelihood of short circuits and maintaining the integrity of components like inductors and capacitors by stabilizing their properties.
Implementation Method 1
the interlayer connection conductor and the insulating layer are pressure-bonded or the like to be deformed
Data Source
AI summary
An electronic component includes a plurality of base materials laminated in a thickness direction, interlayer connection conductor provided in base materials and filled in a through hole penetrating in the thickness direction, and internal electrode formed at a position where internal electrode overlaps interlayer connection conductor when viewed from the thickness direction, internal electrode being formed with base material interposed between internal electrode and interlayer connection conductor. Interlayer connection conductor has a cavity. Cavity being formed so as to be shifted internal electrode side in the thickness direction of the through hole.