Laminated Wall Inductively Coupled Plasma Source
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Solution Overview
Problem
Existing remote plasma sources face premature chamber wall deterioration due to capacitive coupling between the coil and the plasma, which is not effectively addressed by prior solutions like Faraday shields that increase cost, complexity, and reduce inductive coupling.
Innovation Solution
A remote plasma source chamber design with a laminated wall structure incorporating a conductive middle portion between dielectric layers, a single or multi-turn coil, and a thermal transfer medium to minimize capacitive coupling while maintaining effective thermal transport, using additive manufacturing to molecularly couple layers for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a Faraday shield is placed between the coil and chamber wall, then capacitive coupling is reduced, but device complexity and cost increase
Solution Approach 1:
The conductive layer is embedded within the dielectric chamber wall structure, creating a nested configuration where the conductive shielding layer is integrated inside the wall rather than being a separate external component. This nesting approach reduces device complexity while maintaining the capacitive coupling mitigation function.
Solution Approach 2:
The chamber wall is constructed as a composite structure combining dielectric material with an embedded conductive layer. This composite design provides both the insulating properties of the dielectric and the shielding properties of the conductive layer, reducing capacitive coupling without requiring a separate Faraday shield structure.
2Object-affected harmful factors
If a Faraday shield is placed between the coil and chamber wall, then capacitive coupling is reduced, but manufacturing cost increases
Solution Approach 1:
The shielding function and chamber wall structure are merged into a single integrated component. The conductive layer is incorporated during chamber wall manufacturing, eliminating the need for separate shield assembly and reducing overall manufacturing cost.
Solution Approach 2:
The composite chamber wall structure combines multiple materials (dielectric and conductive) into a single manufactured component, allowing for cost-effective production through integrated manufacturing processes rather than assembling separate expensive components.
3Power
If the coil is placed closer to the plasma vessel, then inductive coupling efficiency improves, but arcing risk increases
Solution Approach 1:
The dielectric chamber wall acts as an intermediary barrier between the coil and plasma vessel, allowing the coil to be positioned close to the plasma for efficient inductive coupling while the dielectric material prevents direct contact and reduces arcing risk.
Solution Approach 2:
The composite wall structure with embedded conductive layer provides both electrical insulation and field management properties, enabling close coil positioning for high power transfer while the conductive layer manages electrostatic fields to prevent arcing.
4Ease of manufacture
If a traditional dielectric chamber wall is used, then manufacturing is simple, but thermal transport efficiency is insufficient
Solution Approach 1:
The chamber wall is constructed as a composite structure where the dielectric provides manufacturing simplicity and structural integrity, while the embedded conductive layer enhances thermal transport efficiency through its superior thermal conductivity.
Solution Approach 2:
The conductive layer is strategically positioned within the dielectric wall to specifically address thermal transport needs in critical regions, while the bulk dielectric material maintains manufacturing simplicity and structural properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design extends the lifetime of the plasma source by reducing capacitive sputtering of the chamber walls, maintaining efficient thermal transport, and achieving balanced inductive and capacitive coupling for plasma ignition and maintenance.
Implementation Method 1
The coil is biased with AC power to inductively couple power into a plasma within the chamber
Implementation Method 2
a thermal transfer medium to minimize capacitive coupling while maintaining effective thermal transport
Data Source
AI summary
This disclosure describes systems, methods, and apparatus for making and using a single-turn coil on a remote plasma source to reduce capacitive coupling between the coil and a plasma, and/or a laminated chamber wall including at least one conductive layer that reduces capacitive coupling between the coil and the plasma. Where a laminated chamber wall is used, the coil can either be a single or multi-turn coil. Additive processes can be used to fuse or bond the conductive layer(s) to lower layers (e.g., dielectric layers) as well as to fuse or bond a final layer (e.g., dielectric) to an outermost conductive layer. Further, a method is disclosed wherein a conductive layer within the lamination is biased during plasma ignition and then the bias is reduced after ignition.