Power Semiconductor Module with Laminated Wiring for Inductance Reduction
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Solution Overview
Problem
Conventional power semiconductor modules face challenges in size reduction and inductance minimization while maintaining efficient heat dissipation and simple manufacturing processes, with ceramic multilayer boards offering high thermal resistance and complex bus bar configurations complicating inductance reduction.
Innovation Solution
A power semiconductor module design featuring a metallic base plate with laminated wiring patterns via resin insulating layers, allowing for size reduction and inductance minimization while efficiently dissipating heat through a simple configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a ceramic multilayer board is used to reduce size and inductance, then the module size and inductance are reduced, but the thermal resistance increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The module is divided into distinct functional regions: a first region with the power semiconductor element mounted directly on the metallic base plate for heat dissipation, and a second region with the laminated wiring patterns for electrical connection. This segmentation allows simultaneous optimization of thermal and electrical performance.
Solution Approach 2:
Different regions of the module have different structural characteristics optimized for their specific functions. The first region has direct metal-to-metal contact for thermal conduction, while the second region has laminated insulating layers and wiring patterns for electrical connection and inductance reduction.
2Reliability
If a ceramic multilayer board is used to reduce inductance, then the inductance is reduced, but the manufacturing complexity increases
Solution Approach 1:
The insulating layer and wiring pattern are merged into a single laminated structure. The insulating layer is formed by laminating a resin board onto the metallic base plate, and the wiring pattern is simultaneously formed on the resin board, simplifying the manufacturing process compared to traditional ceramic multilayer boards.
3Reliability
If a metallic pole is used for connection between multilayer metallic circuit boards, then electrical connection is achieved, but the structure becomes complex and is not suitable for large current capacitance
Solution Approach 1:
The metallic pole connection structure is extracted and replaced with a planar laminated wiring pattern. The electrical connection between layers is achieved through conductive paths on the laminated insulating layer rather than through three-dimensional metallic poles, simplifying the structure and improving suitability for large current applications.
4Ease of manufacture
If the distance between bus bars is expanded to improve resin fluidity, then manufacturing is easier, but the inductance reduction effect is decreased
Solution Approach 1:
The thickness of the laminated insulating layer is optimized to balance resin fluidity during molding and inductance reduction. By controlling the layer thickness parameter, both manufacturing feasibility and electrical performance are simultaneously achieved without requiring expanded bus bar distances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves size reduction and inductance minimization while ensuring effective heat dissipation and simplified manufacturing, reducing thermal resistance and inductance, thus enhancing the performance and reliability of power semiconductor modules.
Implementation Method 1
a second wiring pattern for a second layer is laminated via only a second insulating layer made of resin
Implementation Method 2
efficiently dissipating heat through a simple configuration
Implementation Method 3
a base plate as a metallic heat dissipating body
Implementation Method 4
reduction of inductance is important
Data Source
AI summary
A power semiconductor module includes a base plate as a metallic heat dissipating body, a first insulating layer on the base plate, and a first wiring pattern on the first insulating layer. On a predetermined region that is a part of the first wiring pattern, a second wiring pattern for a second layer is laminated via only a second insulating layer made of resin, thereby forming a pattern laminated region. A power semiconductor element is mounted in a region other than the pattern laminated region on the first wiring pattern. The base plate, the first insulating layer, the first wiring pattern, the second insulating layer, the second wiring pattern, and the power semiconductor element are integrally sealed with a transfer mold resin, thus obtaining the power semiconductor module.