Lamination Device with Annular Reinforced Portion
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Solution Overview
Problem
The challenge is to manufacture lamination devices with reduced thickness without compromising their rigidity and making them prone to breakage, especially when multiple thin wafers are laminated, which is difficult to handle and laminate effectively.
Innovation Solution
A lamination device manufacturing method using a reinforced wafer with a device area and an outer circumferential redundant area, where the rear surface corresponding to the device area is ground to form a predetermined thickness, and the outer circumferential area is left as an annular reinforced portion, allowing for wafer lamination without breakage by maintaining the configuration of the reinforced wafer, even when reduced in thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If wafer thickness is reduced to 100 μm or less, then lamination device thickness can be reduced, but wafer rigidity significantly lowers making it fragile and difficult to handle
Solution Approach 1:
The wafer is designed with non-uniform thickness: the device area is ground to a thin thickness (100 μm or less) to reduce overall device thickness, while the outer circumferential area is left at original thickness to form an annular reinforced portion that provides rigidity and facilitates handling. This local differentiation resolves the contradiction between thinness and strength.
2Adaptability or versatility
If multiple thin wafers are laminated, then lamination device functionality is enhanced, but handling and lamination process becomes difficult due to fragility
Solution Approach 1:
By providing an annular reinforced portion at the outer circumference of each wafer, the invention enables multiple thin wafers to be handled and laminated easily despite their fragility. The reinforced portion serves as a robust handling area that does not interfere with the thin device area, resolving the contradiction between enhanced functionality through multi-layer lamination and ease of operation.
3Length of moving object
If wafer is ground uniformly to reduced thickness, then lamination device thickness is reduced, but wafer becomes prone to breakage
Solution Approach 1:
The selective grinding process grounds only the device area to reduced thickness while leaving the outer circumferential area at original thickness, creating an annular reinforced portion. This local quality differentiation ensures the lamination device achieves reduced overall thickness while maintaining breakage resistance through the reinforced outer portion.
4Manufacturing precision
If outer circumferential area is removed to match device area diameter, then lamination precision improves, but wafer rigidity is compromised
Solution Approach 1:
The invention maintains the outer circumferential redundant area as an annular reinforced portion rather than removing it. This redundant area provides necessary rigidity for wafer handling and lamination processes, while the thin device area ensures reduced overall device thickness. The reinforced portion enables precise lamination alignment without compromising wafer strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of lamination devices that are thin in overall thickness without breakage, ensuring rigidity and facilitating handling and lamination, even when multiple wafers are layered, by maintaining the configuration of the reinforced wafer with a reduced device area thickness.
Implementation Method 1
an area of an rear surface corresponding to the device area is ground so that the device area may be formed to have a predetermined thickness
Implementation Method 2
a rear surface of the reinforced wafer corresponding to the device area is faced to and joined to the front surface of the underlying wafer with corresponding streets aligned with each other, thus forming a lamination wafer
Data Source
AI summary
A lamination device manufacturing method for manufacturing a lamination device using a reinforced wafer formed with an annular reinforced portion, includes a wafer lamination step in which a rear surface of the reinforced wafer corresponding to the device area is faced to and joined to the front surface of an underlying wafer with corresponding streets aligned with each other, thus forming a lamination wafer; an electrode connection step in which a via-hole is formed at a position where an electrode is formed in each of the devices of the reinforced wafer constituting part of the lamination wafer, so as to reach a corresponding electrode formed in each of the devices of the underlying wafer, and the via-hole is filled with a conductive material to connect the electrodes; and a division step in which after the electrode connection step is executed, the lamination wafer is cut along the streets and divided into individual lamination devices.