Embedding Large Dies in Component Carriers with Nanoparticle Fillers
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Solution Overview
Problem
The challenge lies in efficiently embedding large components, such as large dies, into component carriers with minimal mechanical stress and ensuring reliable filling of gaps between the component and adjacent layer structures, as traditional methods often result in component damage due to excessive mechanical stress and inadequate resin filling.
Innovation Solution
A component carrier is designed with a stack of electrically conductive and insulating layer structures, where the component is embedded with a gap of less than 100 μm, and a filler medium comprising filler particles, typically nanoparticles, is used to fill these gaps, reducing mechanical stress and ensuring robust encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional embedding methods are used for large dies, then the component can be embedded in the component carrier, but excessive mechanical stress is applied to the component causing damage
Solution Approach 1:
A stress relief structure comprising a recess and a filler element is provided beforehand in the component carrier. The recess is positioned to receive and accommodate the large die, while the filler element fills the gap between the die and the recess walls. This pre-configured structure cushions and distributes mechanical stress away from the component during embedding, preventing damage while maintaining reliability.
2Volume of moving object
If the gap between component and layer structures is reduced to less than 100 μm for compact embedding, then space utilization is improved, but traditional resin filling methods fail to adequately fill the gap
Solution Approach 1:
The invention changes the physical parameters of the filling approach by introducing a stress relief structure with a recess that pre-defines the gap space. The filler element is specifically designed to match the recess dimensions, ensuring complete gap filling. This parameter change from conventional resin injection to structured filler placement enables adequate filling of the reduced <100 μm gap while maintaining manufacturing feasibility.
3Area of stationary object
If large dies are embedded with minimal gaps for compact design, then space efficiency is improved, but mechanical stress concentration increases causing component damage
Solution Approach 1:
The embedding structure is segmented into distinct functional zones: a recess portion that provides the compact embedding space for the large die, and a separate filler element portion that occupies the gap between the die and recess walls. This segmentation allows the gap region to act as a stress relief zone, distributing mechanical loads away from the component while maintaining the compact <100 μm gap design for space efficiency.
Data Source
AI summary
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component embedded in the stack so that a gap of less than 100 μm, in particular less than 60 μm, remains between at least one sidewall of the component and a sidewall of an adjacent one of the layer structures or a further component embedded in the stack; and a filler medium including filler particles, wherein the filler medium at least partially fills the gap. In addition, a method of manufacturing a component carrier is provided.