Laser-Ablated Embedded Circuit Pattern Fabrication
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Solution Overview
Problem
The existing over-plate and over-etch processes for forming circuit patterns are slow and costly, leading to inefficiencies and potential shorts in circuit formation.
Innovation Solution
A method involving the formation of laser-ablated artifacts through a resist and conductive layer into a dielectric layer, followed by filling and selectively removing conductive layers to create an embedded circuit pattern without the need for over-plate and over-etch processes, resulting in a dimple-free pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If over-plate and over-etch processes are used to form circuit patterns, then complete filling and short prevention are achieved, but fabrication time and cost increase significantly
Solution Approach 1:
The patent applies preliminary action by forming a mandrel structure with precise dimensions before copper deposition. The mandrel is designed with specific height and width parameters that pre-determine the final copper fill dimensions, eliminating the need for subsequent over-etching to remove excess copper. This preliminary structuring ensures complete feature filling while maintaining precise dimensional control.
Solution Approach 2:
The patent replaces the mechanical/chemical over-etch process with a controlled deposition approach. Instead of using etching chemistry to remove excess copper, the method uses physical mandrel structures and controlled copper deposition to achieve precise fill levels, substituting a mechanical positioning system for a chemical removal system.
2Manufacturing precision
If over-plate process is used to ensure complete feature filling, then dimple formation is prevented, but process complexity and cost increase
Solution Approach 1:
The patent extracts the critical dimensional control function from the copper deposition process itself and places it in the mandrel structure. By removing the need for over-plating and subsequent over-etching, the method eliminates redundant process steps while maintaining complete feature filling through the mandrel's physical constraints.
Solution Approach 2:
The patent changes the approach from controlling copper fill through deposition parameters (over-plate) and removal parameters (over-etch) to controlling fill through mandrel geometric parameters (height, width, shape). This parameter transformation simplifies the process by using physical dimensions rather than chemical/process parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the rapid and cost-effective fabrication of dimple-free embedded circuit patterns, eliminating the need for time-consuming and costly over-plate and over-etch processes.
Implementation Method 1
forming laser-ablated artifacts through the first resist layer, through the first conductive layer, and at least partially into the dielectric layer
Data Source
AI summary
A method of fabricating a substrate includes forming a first conductive layer on a dielectric layer, forming a resist layer on the first conductive layer, and forming laser-ablated artifacts through the first resist layer, through the first conductive layer, and at least partially into the dielectric layer. A second conductive layer is formed within the laser-ablated artifacts. The laser-ablated artifacts are filled to form an overfilled circuit pattern. The resist layer and the first conductive layer are removed. Further, a portion of the overfilled circuit pattern is removed to form an embedded circuit pattern embedded within the dielectric layer.