Laser Ablation for Laser Diode Submount Metal Layer Patterning
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Solution Overview
Problem
Current methods for manufacturing laser diode units are inefficient and costly due to the formation of burrs and angled positions during the removal of metal layers, which affect the operation and alignment of laser diodes, and are difficult to control, especially in mass production.
Innovation Solution
The use of a high power pulsed laser to ablate metal layers in specific regions, controlling parameters such as pulse repetition rate, pulse duration, and wavelength to vaporize metal without melting, ensuring clean, sharp edges and preventing burr formation, allowing for cost-effective and efficient production of submounts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional wet etching is used to remove metal layers, then the process is fast and cost-efficient, but burrs are formed and cutting edges are not planar
Solution Approach 1:
The patent replaces the mechanical wet etching process with a laser-based ablation process. The laser beam directly removes metal material through vaporization without requiring chemical solutions, thereby eliminating burr formation and achieving planar cutting edges while maintaining high processing speed.
Solution Approach 2:
The patent changes the fundamental parameter of the removal process from chemical etching to thermal ablation. By controlling laser parameters such as pulse duration, power density, and scanning speed, the process achieves precise material removal with clean edges, resolving the contradiction between speed and precision.
2Manufacturing precision
If ion dry etching is used to provide sharp planar vertical edges, then manufacturing precision is improved, but the process is slow and expensive
Solution Approach 1:
The patent replaces the slow ion dry etching process with laser ablation. The laser directly vaporizes metal material at high speed while maintaining precise control over the cutting edge geometry, achieving both sharp planar edges and high processing speed simultaneously.
Solution Approach 2:
The patent employs pulsed laser operation with controlled pulse duration and repetition rate. This periodic action allows for precise material removal by delivering energy in controlled bursts, achieving clean edges without the slowness of continuous ion etching.
3Quantity of substance
If multiple metal sub-layers are removed by conventional etching, then complete metal removal is achieved, but the process is difficult to control and affects alignment
Solution Approach 1:
The patent replaces conventional multi-step etching processes with laser ablation. The laser can selectively remove different metal layers with precise control over depth and area, maintaining alignment accuracy while achieving complete metal removal where needed.
Solution Approach 2:
The patent applies laser ablation with spatially varying parameters to achieve different removal depths in different regions. By controlling the laser scanning path and parameters, complete removal is achieved in some areas while preserving alignment-critical regions, resolving the contradiction between complete removal and alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of high-quality laser diode units with sharp, planar edges, reducing production costs and improving the reliability and alignment of laser diodes by precisely controlling the ablation process, making it suitable for mass production.
Implementation Method 1
a high power pulsed laser operative to ablate the desired surface regions of the submount's metalized layer
Implementation Method 2
controlling parameters such as pulse repetition rate, pulse duration, and wavelength to vaporize metal without melting
Data Source
AI summary
A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation.