Laser Ablation Tape for Microelectronic Interconnect Formation
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Solution Overview
Problem
The miniaturization of microelectronic devices leads to smaller attachment structures, making them more susceptible to damage during fabrication processes, resulting in reliability issues and yield loss, as existing methods like photo-resist deposition and chemical etching can cause damage and contamination.
Innovation Solution
The use of a laser ablation tape that can be attached to bond pads on microelectronic devices, allowing for the formation of vias by laser ablation to expose bond pads, followed by solder paste deposition and reflow to form interconnects, eliminating the need for etching processes and minimizing surface contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photo-resist deposition and chemical etching methods are used to form interconnects, then interconnect formation is achieved, but the smaller attachment structures become susceptible to damage and contamination
Solution Approach 1:
The patent replaces chemical etching processes with a mechanical/tactile alignment system using a template structure. The template provides physical guidance for interconnect formation without requiring chemical processes that could damage or contaminate the smaller attachment structures, thus resolving the contradiction between achieving precise interconnect formation and avoiding harmful chemical effects.
Solution Approach 2:
The template structure serves as an intermediary element between the attachment structures and the interconnect formation process. This template mediates the formation process by providing a protective and guiding framework that enables precise interconnect creation while shielding the vulnerable attachment structures from direct exposure to harmful chemical etchants.
2Productivity
If attachment structures are miniaturized to achieve faster and smaller microelectronic devices, then device performance is improved, but reliability and yield decrease due to susceptibility to fabrication damage
Solution Approach 1:
The template structure provides beforehand cushioning or protection for the miniaturized attachment structures during the interconnect formation process. By establishing this protective framework in advance, the patent enables miniaturization to proceed while pre-shielding the vulnerable structures from fabrication damage, thus maintaining both device performance and reliability.
3Ease of manufacture
If etching processes are used for interconnect formation, then interconnects can be created, but surface contamination increases and planarity is compromised
Solution Approach 1:
The patent extracts or removes the harmful etching processes from the interconnect formation methodology. By eliminating the chemical etching step entirely and replacing it with a template-guided formation process, the invention achieves interconnect creation without generating surface contamination or compromising planarity, thus resolving the contradiction between ease of manufacture and harmful byproducts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the risk of damage to microelectronic devices and underfill materials, improves process reliability, and maintains planarity, while allowing for the formation of reliable microelectronic interconnects without the need for etching, thus enhancing the yield and reliability of microelectronic devices.
Implementation Method 1
laser ablating at least one via through the laser ablation tape to expose at least a portion of the at least one bond pads
Data Source
AI summary
A tape capable of laser ablation may be used in the formation of microelectronic interconnects, wherein the tape may be attached to bond pads on a microelectronic device and vias may be formed by laser ablation through the tape to expose at least a portion of corresponding bond pads. The microelectronic interconnects may be formed on the bond pads within the vias, such as by solder paste printing and solder reflow. The laser ablation tape can be removed after the formation of the microelectronic interconnects.