Semiconductor Laser Assembly Alignment for Reflection-Safe Emission
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Solution Overview
Problem
Existing light-emitting devices face challenges in achieving efficient heat dissipation and maintaining light intensity due to the protrusion of the light-emitting end surface from the submount, leading to potential reflection and decreased brightness.
Innovation Solution
A method for manufacturing a light-emitting device that involves determining and controlling the distance between the light-emitting end surface and the submount surface using alignment marks, with a bridge-shaped member positioned to overlap the end surface but not the alignment marks, allowing for accurate measurement and assembly verification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the light-emitting end surface protrudes from the submount, then the semiconductor laser element can be properly positioned, but reflection occurs and light intensity decreases
Solution Approach 1:
The patent introduces a bridge-shaped member as an intermediary component positioned between the submount and the semiconductor laser element. This bridge member includes a light-shielding portion that extends toward the light-emitting end surface, acting as a mediator to block reflected light from reaching the submount while still allowing the laser element to function properly.
2Temperature
If the light-emitting end surface protrudes from the submount, then the semiconductor laser element can be properly positioned, but heat dissipation efficiency decreases
Solution Approach 1:
The bridge-shaped member serves as a thermal intermediary, providing a dedicated heat dissipation path from the semiconductor laser element to the submount. The bridge member's thermal conductivity is optimized to efficiently conduct heat away from the laser element while maintaining the necessary protrusion distance for proper positioning.
3Manufacturing precision
If alignment marks are placed near the light-emitting end surface, then positioning accuracy improves, but the bridge-shaped member cannot be properly disposed
Solution Approach 1:
The patent resolves the spatial conflict by utilizing the vertical dimension. The alignment marks are positioned in a region that appears to overlap with the bridge-shaped member in top view, but by specifying different height positions, the marks are placed above or below the bridge member, eliminating physical interference while maintaining positioning accuracy.
Solution Approach 2:
The patent applies local quality by creating different spatial zones with different functions. The alignment mark region is optimized for positioning accuracy, while the bridge member region is optimized for structural support and heat dissipation. By allowing overlap in top view but separating in the vertical dimension, each component can fulfill its specific function without interference.
Data Source
AI summary
A method for manufacturing a light-emitting device includes: preparing a submount including a position specifying portion that specifies a position of a front surface; determining a first distance between a light-emitting end surface and a first alignment mark of a semiconductor laser element; disposing the semiconductor laser element so that the light-emitting end surface protrudes from the front surface of the submount in a top view; disposing a bridge-shaped member at a position overlapping with the light-emitting end surface and not overlapping with the first alignment mark and the position specifying portion; measuring a second distance between a position of the first alignment mark and a position of the front surface specified by the position specifying portion; calculating a third distance by subtracting the second distance from the first distance; and determining whether the light-emitting device is a defective product by comparing the third distance and a predetermined value.