Laser Annealing of Ceramic Substrate Processing Chamber Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ceramic components used in substrate processing chambers are prone to brittle failure modes such as cracking and chipping due to microcracks, which lead to reduced durability and increased erosion in energized gas environments.
Innovation Solution
Localized surface annealing of ceramic components using a laser beam to heal and close microcracks, increasing the Vickers hardness and fracture resistance without subjecting the entire component to elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic materials are used to form internal chamber components exposed to energized gas or plasma, then resistance to erosion and thermal degradation is improved, but the components become susceptible to brittle failure through crack propagation
Solution Approach 1:
The patent applies preliminary action by performing laser annealing on the ceramic components before they are installed in the chamber. This pre-treatment heals microcracks and strengthens the surface, preventing future brittle failure while maintaining the erosion and thermal resistance properties of the ceramic material
Solution Approach 2:
The patent changes the physical and chemical parameters of the ceramic surface through laser annealing. The laser heating process modifies the microstructure by healing microcracks, densifying the surface, and altering the crystalline structure, thereby transforming the material from a brittle state to a strengthened state with improved fracture resistance
2Reliability
If amorphous or microcrystalline ceramic materials are used, then good resistance to erosion by energized gases is achieved, but the materials are particularly susceptible to brittle failure through crack propagation
Solution Approach 1:
The laser annealing process fundamentally changes the microstructural parameters of amorphous and microcrystalline ceramics. By heating the material above its glass transition temperature or recrystallization temperature and then rapidly cooling it, the process heals microcracks, reduces porosity, and creates a denser, more homogeneous structure that resists crack propagation while preserving the erosion resistance
3Strength
If ceramic components are subjected to elevated temperatures for annealing, then microcracks can be healed, but the entire component undergoes thermal degradation
Solution Approach 1:
The patent applies segmentation by dividing the annealing process into localized regions rather than treating the entire component uniformly. The laser beam is directed only at specific areas containing microcracks, heating and healing only those localized zones while leaving the rest of the component at ambient temperature, thus avoiding overall thermal degradation
Solution Approach 2:
The patent implements local quality by applying thermal treatment only where needed - specifically at regions with microcracks - rather than uniformly across the entire component. This localized approach allows microcrack healing in critical areas while preserving the original properties of the rest of the component and avoiding unnecessary thermal exposure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process significantly enhances the surface smoothness, hardness, and fracture strength of the components, reducing chipping and cracking, and extending their process lifetime by at least 10% in terms of Vickers hardness and up to 50% in fracture stress.
Implementation Method 1
directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves
Implementation Method 2
annealing the microcracks to heal and close off the microcracks by themselves
Data Source
AI summary
A method of fabricating a processing chamber component comprises forming a processing chamber component having a structural body with surface regions having microcracks, and directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves.