Laser-Perforated Carrier Film for Ceramic Circuit Board Production
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Solution Overview
Problem
Current methods for producing ceramic multilayer circuits are cumbersome, prone to dimensional and positional deviations, require multiple machines and processes, and have limitations in miniaturization of via diameters and conductor track widths, leading to inefficiencies and increased complexity in production.
Innovation Solution
A method using a laser-perforated carrier film to create conductor tracks and vias on a ceramic film, where the carrier film acts as a disposable printing template, eliminating the need for separate stencils and allowing for simultaneous printing of vias and conductor tracks, followed by removal and lamination with other layers for sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical punching and separate printing processes are used to create vias and conductor tracks, then the production process can be completed with conventional equipment, but dimensional accuracy and positional accuracy deteriorate due to cumulative errors across multiple process steps
Solution Approach 1:
The patent combines the punching and printing processes into a single integrated laser-based process. The laser directly writes both the via holes and conductor tracks in one step on the green ceramic film, eliminating the need for separate punching and printing operations. This merging of processes eliminates cumulative positioning errors and maintains high dimensional accuracy while reducing the total number of process steps.
Solution Approach 2:
The patent replaces the mechanical punching system and separate printing system with a laser-based direct writing system. Instead of using mechanical punches to create vias and then separate printing processes for conductor tracks, the laser directly ablates or modifies the green ceramic film to create both features simultaneously. This substitution eliminates mechanical contact and associated positioning errors.
2Productivity
If multiple separately configured machines are used for various processing steps, then each machine can be optimized for its specific function, but productivity deteriorates due to the need for multiple machine changes and buffer space occupancy
Solution Approach 1:
The patent employs a laser system that performs multiple functions: it creates via holes, writes conductor tracks, and can potentially perform other modifications on the green ceramic film, all within a single process step. This multi-functional approach eliminates the need for multiple specialized machines (punching machine, printing press, etc.) and their associated buffer spaces, thereby improving productivity and reducing process complexity.
Solution Approach 2:
The patent merges multiple processing functions (punching, printing of vias, printing of conductor tracks) into a single integrated laser processing step. This consolidation eliminates the need for intermediate buffer spaces between processes and removes the downtime associated with machine changes, directly improving production efficiency while simplifying the overall manufacturing process.
3Manufacturing precision
If conventional punching and printing processes are used, then the production process can be completed with standard equipment, but miniaturization capability deteriorates with via diameters limited to around 80 μm and track width to around 130 μm
Solution Approach 1:
The patent replaces mechanical punching and printing systems with a laser-based direct writing system. The laser can be precisely controlled to create features at the micrometer and sub-micrometer scale, enabling via diameters and conductor track widths well below the 80 μm and 130 μm limits of conventional mechanical processes. This substitution of mechanical systems with optical/thermal laser systems is what enables the miniaturization capability.
4Manufacturing precision
If quality control is performed after each stamping and printing process, then dimensional accuracy can be maintained, but productivity deteriorates due to the time required for multiple inspection steps
Solution Approach 1:
The patent replaces multiple mechanical processing steps (punching, separate printing operations) with a single laser-based process. Since there is only one process step instead of multiple sequential steps, there is only one quality control checkpoint needed rather than multiple inspections. This reduction in the number of process steps directly reduces the total inspection time and improves productivity while maintaining dimensional accuracy through the inherent precision of the laser process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the production process, reduces the need for multiple tools and steps, enhances miniaturization capabilities, and streamlines quality control, resulting in more precise and cost-effective ceramic multilayer circuit production.
Implementation Method 1
the carrier film is perforated by lasers to form at least one conductor track and/or the carrier film and the ceramic film are passed through together to form at least one through-connection
Data Source
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AI summary
The invention relates to a method for the production of a circuit board layer for a particularly multi-layer circuit board, wherein a ceramic foil is used that has a carrier foil disposed thereon, the carrier foil is perforated by lasing in order to form at least one conductor path, and/or the carrier foil and the ceramic foil are mutually perforated by lasing in order to form at least one feedthrough, the circuit board and/or the feedthrough are subsequently created by printing, wherein the carrier foil forms a screen print, and the carrier foil is subsequently removed from the ceramic foil.