Laser Chip Micropipe Cooling for Compact Heat Dissipation
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Solution Overview
Problem
The existing semiconductor laser-pumped all-solid-state laser systems require additional heat sink structures for improved cooling, which increase manufacturing costs and volume, making them unsuitable for microdevice applications.
Innovation Solution
A manufacturing method for laser chips that involves forming a first electroplating layer, a pattern layer, and a first metal coating, with a hollow micropipe created between the metal coating and the electroplating layer, allowing for efficient heat dissipation through liquid circulation while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional heat sink structures are added to improve cooling efficiency, then heat dissipation performance is improved, but device volume and manufacturing cost increase
Solution Approach 1:
The patent merges the heat dissipation function directly into the laser chip structure by forming micropipes within the metal coating layer during the manufacturing process. This integration eliminates the need for separate heat sink structures, achieving efficient heat dissipation while maintaining compact device volume.
Solution Approach 2:
The patent introduces liquid cooling channels (micropipes) directly into the laser chip structure. These micropipes allow liquid coolant to flow through the chip, providing efficient heat removal through convection and phase change, thereby improving heat dissipation performance without increasing device volume.
2Temperature
If additional heat sink structures are added to improve cooling efficiency, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the heat dissipation function with the laser chip manufacturing process itself. The micropipes are formed during the metal coating and patterning steps, integrating heat dissipation structure creation into the existing manufacturing flow, which reduces overall manufacturing cost by eliminating separate heat sink components and assembly steps.
Solution Approach 2:
The patent performs preliminary actions by forming the micropipe structures during the metal coating process before final chip assembly. The pattern layer is created, metal coating is applied, and then the pattern layer is removed to form micropipes, all during the manufacturing process itself, which simplifies subsequent assembly and reduces manufacturing costs.
3Temperature
If additional heat sink structures are added to improve cooling efficiency, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function directly into the laser chip structure by forming micropipes within the metal coating layer during the manufacturing process. This integration eliminates the need for separate heat sink structures, achieving efficient heat dissipation while maintaining compact device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances heat dissipation effectiveness while ensuring a controllable overall volume, reducing manufacturing costs and enabling the use of laser chips in microdevice applications.
Implementation Method 1
the micropipe is used as a space for circulating liquid to flow, and the heat generated by the laser chip is exported by circulating liquid
Implementation Method 2
forming a first electroplating layer on an epitaxial layer
Data Source
AI summary
Disclosed are a manufacturing method for a laser chip and a laser chip. The manufacturing method comprises: step S1, forming a first electroplating substrate on an epitaxial layer; step S2, forming an organic pattern layer on the first electroplating substrate, wherein the pattern layer defines a hollowed-out area and a part of the first electroplating substrate is exposed to the pattern layer by means of the hollowed-out area; step S3, forming a first metal coating on the first electroplating substrate, wherein the first metal coating completely covers the pattern layer and the part of the first electroplating substrate not covered by the pattern layer; and step S4, removing the pattern layer to have a hollow channel formed between the first metal coating and the first electroplating substrate, wherein the channel is provided with at least one inlet and at least one outlet running through the first metal coating.