Laser Cleaning Substrate Processing Focus Rings
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Solution Overview
Problem
The existing substrate processing apparatus faces challenges in removing deposits attached to components with large temperature differences, particularly in the narrow gaps between the inner and outer focus rings, which hampers the apparatus' working ratio due to difficulties in plasma penetration and cleaning.
Innovation Solution
The apparatus incorporates a laser beam transmission member to irradiate a laser beam into the gap between the inner and outer focus rings, or uses a focus ring moving apparatus to expose the gap to plasma, or employs a plasma biasing apparatus to increase plasma density in the gap, facilitating the removal of deposits without degrading the apparatus' performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the inner focus ring is cooled down to control temperature distribution, then uniform plasma processing is achieved, but deposits are attached to the inner focus ring in the gap between the inner and outer focus rings
Solution Approach 1:
The patent replaces the conventional mechanical cleaning method (opening the chamber to atmosphere and manually cleaning) with a laser beam transmission member that uses optical energy to heat and remove deposits. The laser beam is transmitted through the laser beam transmission member to heat the deposits on the inner focus ring, causing them to be removed without mechanical intervention.
Solution Approach 2:
The patent changes the temperature parameter of the deposits by irradiating them with a laser beam. The laser beam transmission member transmits the laser beam to locally heat the deposits, changing their thermal state and facilitating their removal from the inner focus ring surface.
2Stability of the object's composition
If the gap between the inner focus ring and outer focus ring is narrow, then thermal coupling is improved, but plasma cannot enter the gap to remove deposits through ashing process
Solution Approach 1:
The patent replaces the plasma-based chemical cleaning method with a laser-based thermal method. The laser beam transmission member transmits laser energy directly to the deposits in the narrow gap, heating and removing them without requiring plasma penetration into the gap.
Solution Approach 2:
The laser beam transmission member acts as an intermediary that delivers energy to the deposits in the narrow gap between the focus rings. It transmits the laser beam through or to the gap area, enabling remote heating and removal of deposits without direct contact or plasma penetration.
3Object-generated harmful factors
If the chamber is opened to atmosphere to clean deposits, then deposits are removed, but the working ratio of the substrate processing apparatus is degraded
Solution Approach 1:
The patent enables continuous operation by removing the need to open the chamber for cleaning. The laser beam transmission member allows deposits to be removed while the chamber remains sealed and operational, maintaining continuous plasma processing without interruption for maintenance.
Solution Approach 2:
The system performs self-cleaning of the inner focus ring using the laser beam transmission member. The deposits are removed by laser heating during or between processing cycles without requiring external manual intervention or chamber opening, enabling the apparatus to maintain itself during operation.
4Temperature
If the susceptor is cooled down to lower temperature than the inner focus ring, then temperature control is improved, but deposits are attached to the susceptor in the gap between the inner focus ring and susceptor
Solution Approach 1:
The patent uses laser beam irradiation to remove deposits from the susceptor surface in the gap between the inner focus ring and susceptor. The laser beam transmission member delivers thermal energy to heat and remove deposits without mechanical contact or chamber opening.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These solutions effectively remove deposits from the inner focus ring without degrading the working ratio of the substrate processing apparatus by heating the deposits with laser beams or exposing them to increased plasma density, thus maintaining operational efficiency.
Implementation Method 1
a laser beam transmission member which transmits a laser beam; and a laser beam irradiating apparatus which irradiates the laser beam to the laser beam transmission member
Data Source
AI summary
A substrate processing apparatus capable of removing deposits attached on a component of a lower temperature in a gap between two components, temperatures of which are greatly different from each other, without degrading a working ratio of the substrate processing apparatus. In the substrate processing apparatus, a chamber receives a wafer, a focus ring surrounds the wafer disposed in the chamber, a side surface protective member transmits a laser beam, a laser beam irradiating apparatus irradiates the laser beam to the side surface protective member, an inner focus ring of the focus ring is disposed adjacent to the wafer and is cooled down and an outer focus ring surrounds the inner focus ring and is not cooled down in a focus ring, and a facing surface of the side surface protective member faces a gap between the inner focus ring and the outer focus ring.